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ICY7C1373DV25-100BGXI PDF预览

ICY7C1373DV25-100BGXI

更新时间: 2024-11-07 20:50:47
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
31页 333K
描述
ZBT SRAM, 1MX18, 8.5ns, CMOS, PBGA119, 14 X 22 MM, 2.40 MM HEIGHT, LEAD FREE, PLASTIC, BGA-119

ICY7C1373DV25-100BGXI 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:BGA, BGA119,7X17,50针数:119
Reach Compliance Code:compliantECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.8
Base Number Matches:1

ICY7C1373DV25-100BGXI 数据手册

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CY7C1371DV25  
CY7C1373DV25  
PRELIMINARY  
18-Mbit (512K x 36/1M x 18) Flow-Through SRAM  
with NoBL™ Architecture  
Features  
Functional Description[1]  
No Bus Latency(NoBL) architecture eliminates  
The CY7C1371DV25/CY7C1373DV25 is a 2.5V, 512K x 36/  
1 Mbit x 18 Synchronous Flow-through Burst SRAM designed  
specifically to support unlimited true back-to-back Read/Write  
operations without the insertion of wait states. The  
CY7C1371DV25/CY7C1373DV25 is equipped with the  
advanced No Bus Latency (NoBL) logic required to enable  
consecutive Read/Write operations with data being trans-  
ferred on every clock cycle. This feature dramatically improves  
the throughput of data through the SRAM, especially in  
systems that require frequent Write-Read transitions.  
dead cycles between write and read cycles  
• Can support up to 133-MHz bus operations with zero  
wait states  
— Data is transferred on every clock  
• Pin compatible and functionally equivalent to ZBT™  
devices  
• Internally self-timed output buffer control to eliminate  
the need to use OE  
All synchronous inputs pass through input registers controlled  
by the rising edge of the clock. The clock input is qualified by  
the Clock Enable (CEN) signal, which when deasserted  
suspends operation and extends the previous clock cycle.  
Maximum access delay from the clock rise is 6.5 ns (133-MHz  
device).  
• Registered inputs for flow-through operation  
• Byte Write capability  
• Single 2.5V power supply  
• 2.5V I/O power supply  
• Fast clock-to-output times  
— 6.5 ns (for 133-MHz device)  
— 8.5 ns (for 100-MHz device)  
Write operations are controlled by the two or four Byte Write  
Select (BWX) and a Write Enable (WE) input. All writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Three synchronous Chip Enables (CE1, CE2, CE3) and an  
asynchronous Output Enable (OE) provide for easy bank  
selection and output tri-state control. In order to avoid bus  
contention, the output drivers are synchronously tri-stated  
during the data portion of a write sequence.  
• Clock Enable (CEN) pin to enable clock and suspend  
operation  
• Synchronous self-timed writes  
• Asynchronous Output Enable  
• Offered in JEDEC-standard lead-free 100 TQFP,  
119-Ball BGA and 165-Ball fBGA packages  
• Three chip enables for simple depth expansion  
• Automatic Power-down feature available using ZZ  
mode or CE deselect  
• JTAG boundary scan for BGA and fBGA packages  
• Burst Capability—linear or interleaved burst order  
• Low standby power  
Selection Guide  
133 MHz  
6.5  
100 MHz  
8.5  
Unit  
ns  
Maximum Access Time  
Maximum Operating Current  
210  
175  
mA  
mA  
Maximum CMOS Standby Current  
70  
70  
Notes:  
1. For best-practices recommendations, please refer to the Cypress application note System Design Guidelines on www.cypress.com.  
Cypress Semiconductor Corporation  
Document #: 38-05557 Rev. *B  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised February 21, 2005  

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