是否Rohs认证: | 不符合 | 生命周期: | Transferred |
包装说明: | DIP, DIP14,.3 | Reach Compliance Code: | unknown |
ECCN代码: | EAR99 | HTS代码: | 8542.39.00.01 |
风险等级: | 5.76 | 模拟集成电路 - 其他类型: | SQUARE; TRIANGULAR; SINE; SAWTOOTH; PULSE |
JESD-30 代码: | R-GDIP-T14 | JESD-609代码: | e0 |
负电源电压最大值(Vsup): | -15 V | 负电源电压最小值(Vsup): | -5 V |
标称负供电电压 (Vsup): | -10 V | 功能数量: | 1 |
端子数量: | 14 | 最高工作温度: | 70 °C |
最低工作温度: | 最大输出频率: | 0.1 GHz | |
封装主体材料: | CERAMIC, GLASS-SEALED | 封装代码: | DIP |
封装等效代码: | DIP14,.3 | 封装形状: | RECTANGULAR |
封装形式: | IN-LINE | 电源: | +-5,+-15 V |
认证状态: | Not Qualified | 子类别: | Analog Waveform Generation Functions |
最大供电电流 (Isup): | 20 mA | 最大供电电压 (Vsup): | 15 V |
最小供电电压 (Vsup): | 5 V | 标称供电电压 (Vsup): | 10 V |
表面贴装: | NO | 技术: | BIPOLAR |
温度等级: | COMMERCIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | THROUGH-HOLE | 端子节距: | 2.54 mm |
端子位置: | DUAL | Base Number Matches: | 1 |
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