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IC51-1004-1919 PDF预览

IC51-1004-1919

更新时间: 2024-11-14 00:35:27
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其他 - ETC /
页数 文件大小 规格书
8页 469K
描述
QFP (Quad Flat Packages, Gullwing Leads)

IC51-1004-1919 数据手册

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Series Overview  
*QFP (Quad Flat Packages, Gullwing Leads)  
SMT Devices  
*QFP variations e.g. BQFP...  
Series IC51 (Clamshell)  
QFP, PQFP, TQFP and MQUAD  
0.4mm to 1.27 Pitch  
®
Part Number (Details)  
Specifications  
Insulation Resistance:  
1,000MΩ min. at 100V DC  
-
-
807  
IC51  
064  
4
Dielectric Withstanding Voltage: for 1 minute (socket depended)  
Series No.  
Contact Resistance: 30mΩ max. at 10mA/20mV max.  
Operating Temperature Range: –40°C to +150°C (for type PEI/PSF)  
–55°C to +170°C (for type PES)  
No. of Contact Pins  
–55°C to +170°C (for type PEI)  
10,000 insertions min.  
Number of Sides  
with Contacts  
Mating Cycles:  
Materials and Finish  
Design Number  
Housing: Polysulphone (PSF), glass-filled  
Polyethersulphone (PES), glass-filled  
Polyetherimide (PEI), glass-filled  
Contacts: Beryllium Copper (BeCu)  
Plating: Gold over Nickel  
As specifications for this product differ by pitch  
and material-mix, please contact our Sales Department  
for detailed information.  
Series IC357 and IC402 (Open Top)  
Quad Flat Package (QFP) with 2-Point Contact Type  
0.4 to 0.8mm Pitch  
Part Number (Details)  
Specifications  
Insulation Resistance:  
1,000MΩ min. at 500V DC, pitch 0.4 to 0.8  
Dielectric Withstanding Voltage: 100V AC for 1 minute, pitch 0.5 to 0.8  
Contact Resistance: 30mΩ max. at 10mA/20mV max.  
Operating Temperature Range: –40°C to +150°C  
-
-
100 4 002 *  
IC357  
Series No.  
Mating Cycles:  
Contact Force:  
10,000 insertions min.  
20g to 45g per pin  
No. of Contact Pins  
Number of Sides  
with Contacts  
Materials and Finish  
Housing: Polyetherimide (PEI), glass-filled  
Polyethersulphone (PES) glass-filled  
Contacts: Beryllium Copper (BeCu)  
Design Number  
Positioning Pin  
Plating:  
Gold over Nickel  
N = Without Positioning Pin  
P = With Positioning Pin  
Series IC234 (Open Top)  
Quad Flat Package (QFP) with Shoulder Contact Type  
0.4 to 0.8mm Pitch  
Part Number (Details)  
Specifications  
Insulation Resistance:  
1,000MΩ min. at 100V DC pitch 0.4, 0.5  
1,000MΩ min. at 500V DC pitch 0.65, 0.8  
-
-
017 *  
IC234  
120 4  
Series No.  
Dielectric Withstanding Voltage: 100V AC for 1 minute pitch 0.4, 0.5  
500V AC for 1 minute pitch 0.65  
700V AC for 1 minute pitch 0.8  
No. of Contact Pins  
Contact Resistance:  
Operating Temperature Range: –40°C to +150°C  
Contact Force:  
Mating Cycles:  
30mΩ max. at 10mA/20mV max.  
Number of Sides  
with Contacts  
20g to 80g per pin  
10,000 insertions min.  
Design Number  
Positioning Pin  
Materials and Finish  
N = Without Positioning Pin  
P = With Positioning Pin  
K = Protection Key  
Housing: Polyetherimide (PEI), glass-filled  
Polyethersulphone (PES) glass-filled  
Contacts: Beryllium Copper (BeCu)  
**  
** Protection Key: Prevents IC from releasing during transportation  
Plating:  
Gold over Nickel  
46 Test Solutions  
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE  
DIMENSIONS IN MILLIMETER  

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