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IC41C8513-60T PDF预览

IC41C8513-60T

更新时间: 2024-02-09 15:09:03
品牌 Logo 应用领域
矽成 - ICSI 存储内存集成电路光电二极管动态存储器
页数 文件大小 规格书
17页 231K
描述
512K x 8 bit Dynamic RAM with Fast Page Mode

IC41C8513-60T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:0.400 INCH, TSOP2-28Reach Compliance Code:compliant
风险等级:5.83Is Samacsys:N
访问模式:FAST PAGE最长访问时间:60 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESHI/O 类型:COMMON
JESD-30 代码:R-PDSO-G28JESD-609代码:e0
内存密度:4194304 bit内存集成电路类型:FAST PAGE DRAM
内存宽度:8功能数量:1
端口数量:1端子数量:28
字数:524288 words字数代码:512000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:512KX8
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:SOP封装等效代码:TSOP28,.46
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
电源:5 V认证状态:Not Qualified
刷新周期:1024自我刷新:NO
最大待机电流:0.001 A子类别:DRAMs
最大压摆率:0.1 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUALBase Number Matches:1

IC41C8513-60T 数据手册

 浏览型号IC41C8513-60T的Datasheet PDF文件第1页浏览型号IC41C8513-60T的Datasheet PDF文件第2页浏览型号IC41C8513-60T的Datasheet PDF文件第3页浏览型号IC41C8513-60T的Datasheet PDF文件第5页浏览型号IC41C8513-60T的Datasheet PDF文件第6页浏览型号IC41C8513-60T的Datasheet PDF文件第7页 
IC41C8513 and IC41LV8513  
Functional Description  
Refresh Cycle  
The IC41C8513 and IC41LV8513 are CMOS DRAMs  
optimized for high-speed bandwidth, low power  
applications. During READ or WRITE cycles, each bit is  
uniquely addressed through the 10 address bits. These  
are entered 10 bits (A0-A9) at a time. The row address is  
latched by the Row Address Strobe (RAS). The column  
address is latched by the Column Address Strobe (CAS).  
RAS is used to latch the first ten bits and CAS is used the  
latter nine bits.  
To retain data, 1,024 refresh cycles are required in each  
16 ms period . There are two ways to refresh the memory:  
1. By clocking each of the 1,024 row addresses (A0  
through A9) with RAS at least once every 16 ms . Any  
read, write, read-modify-write or RAS-only cycle re-  
freshes the addressed row.  
2. Using a CAS-before-RAS refresh cycle. CAS-before-  
RAS refresh is activated by the falling edge of RAS,  
while holding CAS LOW. In CAS-before-RAS refresh  
cycle, an internal 10-bit counter provides the row ad-  
dresses and the external address inputs are ignored.  
Memory Cycle  
A memory cycle is initiated by bring RAS LOW and it is  
terminated by returning both RAS and CAS HIGH. To  
ensures proper device operation and data integrity any  
memory cycle, once initiated, must not be ended or  
aborted before the minimum tRAS time has expired. A new  
cycle must not be initiated until the minimum precharge  
time tRP, tCP has elapsed.  
CAS-before-RAS is a refresh-only mode and no data  
access or device selection is allowed. Thus, the output  
remains in the High-Z state during the cycle.  
Power-On  
After application of the VCC supply, an initial pause of  
200 µs is required followed by a minimum of eight initial-  
ization cycles (any combination of cycles containing a  
RAS signal).  
Read Cycle  
A read cycle is initiated by the falling edge of CAS or OE,  
whichever occurs last, while holding WE HIGH. The  
column address must be held for a minimum time specified  
by tAR. Data Out becomes valid only when tRAC, tAA, tCAC  
and tOE are all satisfied. As a result, the access time is  
dependent on the timing relationships between these  
parameters.  
During power-on, it is recommended that RAS track with  
VCC or be held at a valid VIH to avoid current surges.  
Write Cycle  
A write cycle is initiated by the falling edge of CAS and WE,  
whichever occurs last. The input data must be valid at or  
before the falling edge of CAS or WE, whichever occurs  
last.  
4
Integrated Circuit Solution Inc.  
DR028-0A 09/25/2001  

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