Series Overview
SMT Devices
*QFP (Quad Flat Packages, Gullwing Leads)
*QFP variations e.g. BQFP...
Series IC51 (Clamshell)
QFP, PQFP, TQFP and MQUAD
0.4mm to 1.27 Pitch
®
Part Number (Details)
Speci cations
Insulation Resistance:
1,000MΩ min. at 100V DC
-
-
807
IC51
064
4
Dielectric Withstanding Voltage: for 1 minute (socket depended)
Contact Resistance: 30mΩ max. at 10mA/20mV max.
Series No.
Operating Temperature Range: –40°C to +150°C (for type PEI/PSF)
–55°C to +170°C (for type PES)
No. of Contact Pins
–55°C to +170°C (for type PEI)
10,000 insertions min.
Number of Sides
with Contacts
Mating Cycles:
Materials and Finish
Design Number
Housing: Polysulphone (PSF), glass- lled
Polyethersulphone (PES), glass- lled
Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
As speci cations for this product differ by pitch
and material-mix, please contact our Sales Department
for detailed information.
Series IC51 (Clamshell)
Bumper Quad Flat Packages (BQFP)
0.635mm Pitch
Speci cations
Part Number (Details)
Insulation Resistance:
1,000MΩ min. at 500V DC
-
-
827
IC51
100
4
Dielectric Withstanding Voltage: 700V AC for 1 minute
Series No.
Contact Resistance:
Current Rating:
30mΩ max. at 10mA/20mV max.
1A max.
No. of Contact Pins
Operating Temperature Range: –55°C to +170°C
Mating Cycles:
Contact Force:
25,000 insertions min.
50g to 150g per pin
Number of Sides
with Contacts
Materials and Finish
Housing: Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Design Number
Series IC211 (Open Top)
Bumper Quad Flat Packages (BQFP)
0.635mm Pitch
Part Number (Details)
Speci cations
Insulation Resistance:
1,000MΩ min. at 500V DC
-
-
-
002 * *
IC211
132
4
Dielectric Withstanding Voltage: 500V AC for 1 minute
Series No.
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +170°C
No. of Contact Pins
Contact Force:
Mating Cycles:
20g to 80g per pin
10,000 insertions min.
Number of Sides
with Contacts
Materials and Finish
Housing: Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Design Number
Positioning Pin:
N = Without Positioning Pin
Unmarked = With Positioning Pin
*
Protection Key*
K = With Protection Key
Unmarked = Without Protection Key
**Protection Key: Prevents IC from releasing during transportation
.. Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE
–
DIMENSIONS IN MILLIMETER