是否Rohs认证: | 不符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | HBGA, BGA456,26X26,40 |
针数: | 456 | Reach Compliance Code: | unknown |
风险等级: | 5.78 | Is Samacsys: | N |
其他特性: | SEATED HGT-NOM | 地址总线宽度: | |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 66.6 MHz | 外部数据总线宽度: | |
格式: | FIXED POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B456 | JESD-609代码: | e0 |
长度: | 27 mm | 低功率模式: | YES |
端子数量: | 456 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HBGA | 封装等效代码: | BGA456,26X26,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY, HEAT SINK/SLUG |
电源: | 2.5,3.3 V | 认证状态: | Not Qualified |
座面最大高度: | 2.21 mm | 速度: | 200 MHz |
子类别: | Microprocessors | 最大供电电压: | 2.7 V |
最小供电电压: | 2.3 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 宽度: | 27 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
IBM25PPC405GP3DD266CZ | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 266MHz, CMOS, PBGA456, 27 MM, PLASTIC, BGA-456 | |
IBM25PPC405GP-3DE133CZ | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 133.33MHz, CMOS, PBGA456, 27 X 27 MM, ENHANCED, PLASTIC, BGA- | |
IBM25PPC405GP-3DE200C | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|456PIN|PLASTIC | |
IBM25PPC405GP3DE200CZ | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|456PIN|PLASTIC | |
IBM25PPC405GP-3DE200CZ | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA456, 27 X 27 MM, ENHANCED, PLASTIC, BGA-456 | |
IBM25PPC405GP-3DE266C | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|456PIN|PLASTIC | |
IBM25PPC405GP3DE266CZ | ETC |
获取价格 |
MICROPROCESSOR|32-BIT|CMOS|BGA|456PIN|PLASTIC | |
IBM25PPC405GP-3DE266CZ | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 266.66MHz, CMOS, PBGA456, 27 X 27 MM, ENHANCED, PLASTIC, BGA- | |
IBM25PPC405GP-3ED200C | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA413, 25 MM, PLASTIC, BGA-413 | |
IBM25PPC405GP3ED200CZ | IBM |
获取价格 |
RISC Microprocessor, 32-Bit, 200MHz, CMOS, PBGA413, 25 MM, PLASTIC, BGA-413 |