Datasheet > I1790XYI

I1790XYI

更新时间： 2024-02-27 09:21:51

品牌	Logo	应用领域
华邦 - WINBOND		商用集成电路
页数	文件大小	规格书
24页	351K
描述
Speech Synthesizer With RCDG, 180s, DIE

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I1790XYI 技术参数

生命周期：	Obsolete	零件包装代码：	DIE
包装说明：	DIE,	Reach Compliance Code：	unknown
HTS代码：	8542.39.00.01	风险等级：	5.84
商用集成电路类型：	SPEECH SYNTHESIZER WITH RCDG	JESD-30 代码：	X-XUUC-N
功能数量：	1	片上内存类型：	FLASH
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装主体材料：	UNSPECIFIED	封装代码：	DIE
封装形状：	UNSPECIFIED	封装形式：	UNCASED CHIP
认证状态：	Not Qualified	最长读取时间：	180 s
最大供电电压 (Vsup)：	5.5 V	最小供电电压 (Vsup)：	2.4 V
表面贴装：	YES	温度等级：	INDUSTRIAL
端子形式：	NO LEAD	端子位置：	UPPER
Base Number Matches：	1

ISD1700 SERIES

6 MODES OF OPERATIONS

The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode.

6.1 STANDALONE (PUSH-BUTTON) MODE

One can utilize the REC , PLAY , FT , FWD , ERASE , VOL or RESET control to initiate a

desired operation. As completed, the device automatically enters into the power-down state.

6.2 SPI MODE

In SPI mode, control of the device is achieved through the 4-wire serial interface via SPI

commands.

For technical details, please refer to the design guide.

7 TIMING DIAGRAMS

The following estimated timing diagrams are not in proper scale.

7.1 BASIC OPERATION

T_r

T_f

REC

RDY

T_Deb

T_Sc1

T_Set1

T_RU

T_RD

T_ER

LED

Mic+/-,

AnaIn

Figure 12.1: Record Operation with No Sound Effect

- 8 -

1...5 6 789 10 11...24

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