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I17180EYI PDF预览

I17180EYI

更新时间: 2024-02-23 11:38:13
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管商用集成电路
页数 文件大小 规格书
24页 351K
描述
Speech Synthesizer With RCDG, 360s, PDSO28, 8 X 13.40 MM, LEAD FREE, PLASTIC, TSOP1-28

I17180EYI 技术参数

生命周期:Obsolete零件包装代码:TSOP
包装说明:TSOP1,针数:28
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.84商用集成电路类型:SPEECH SYNTHESIZER WITH RCDG
JESD-30 代码:R-PDSO-G28JESD-609代码:e3
长度:11.8 mm功能数量:1
端子数量:28片上内存类型:FLASH
最高工作温度:85 °C最低工作温度:-40 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSOP1
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
认证状态:Not Qualified最长读取时间:360 s
座面最大高度:1.2 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):2.4 V表面贴装:YES
温度等级:INDUSTRIAL端子面层:MATTE TIN
端子形式:GULL WING端子节距:0.55 mm
端子位置:DUAL宽度:8 mm
Base Number Matches:1

I17180EYI 数据手册

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ISD1700 SERIES  
12 ORDERING INFORMATION  
Product Number Descriptor Key  
I17xxxxxxxxx  
Special Features Field:  
Product Name:  
Blank = None  
I = ISD  
01  
= vAlert  
Product Series:  
Tape & Reel:  
17 = 1700  
Blank = None  
Duration:  
R
= Tape & Reel  
30 : 20 – 60 secs  
40 : 26 – 80 secs  
50 : 33 – 100 secs  
60 : 40 – 120 secs  
90 : 60 – 180 secs  
120 : 80 – 240 secs  
150 : 100 – 300 secs  
180 : 120 – 360 secs  
210 : 140 – 420 secs  
240 : 160 – 480 secs  
Temperature:  
I
=
Industrial (-40°C to +85°C)  
Blank = Commercial  
Die (0°C to +50°C)  
Package (0°C to +70°C)  
Package Type:  
X
E
S
=
=
=
Die  
Lead-Free:  
= Lead-Free  
Thin Small Outline Package (TSOP)  
Y
Small Outline Integrated Circuit  
(SOIC) Package  
P
=
Plastic Dual Inline Package (PDIP)  
When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Winbond  
Sales Representatives for any questions and the availability.  
For the latest product information, please contact the Winbond Sales/Rep or  
access Winbond’s worldwide web site at http://www.winbond-usa.com  
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