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HY57V56820CLTP-P PDF预览

HY57V56820CLTP-P

更新时间: 2024-11-30 19:52:35
品牌 Logo 应用领域
海力士 - HYNIX 时钟动态存储器光电二极管内存集成电路
页数 文件大小 规格书
12页 87K
描述
Synchronous DRAM, 32MX8, 6ns, CMOS, PDSO54, 0.400 X 0.875 INCH, 0.80 MM PITCH, LEAD FREE, TSOP2-54

HY57V56820CLTP-P 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSOP2
包装说明:TSOP2, TSOP54,.46,32针数:54
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.84
访问模式:FOUR BANK PAGE BURST最长访问时间:6 ns
其他特性:AUTO/SELF REFRESH最大时钟频率 (fCLK):100 MHz
I/O 类型:COMMON交错的突发长度:1,2,4,8
JESD-30 代码:R-PDSO-G54JESD-609代码:e6
长度:22.238 mm内存密度:268435456 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:8
功能数量:1端口数量:1
端子数量:54字数:33554432 words
字数代码:32000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:32MX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP54,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):260
电源:3.3 V认证状态:Not Qualified
刷新周期:8192座面最大高度:1.194 mm
自我刷新:YES连续突发长度:1,2,4,8,FP
最大待机电流:0.002 A子类别:DRAMs
最大压摆率:0.2 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Bismuth (Sn/Bi)
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL处于峰值回流温度下的最长时间:20
宽度:10.16 mmBase Number Matches:1

HY57V56820CLTP-P 数据手册

 浏览型号HY57V56820CLTP-P的Datasheet PDF文件第2页浏览型号HY57V56820CLTP-P的Datasheet PDF文件第3页浏览型号HY57V56820CLTP-P的Datasheet PDF文件第4页浏览型号HY57V56820CLTP-P的Datasheet PDF文件第5页浏览型号HY57V56820CLTP-P的Datasheet PDF文件第6页浏览型号HY57V56820CLTP-P的Datasheet PDF文件第7页 
HY57V56820C(L)TP  
4 Banks x 8M x 8Bit Synchronous DRAM  
DESCRIPTION  
The HY57V56820C is a 268,435,456bit CMOS Synchronous DRAM, ideally suited for the main memory applications which require  
large memory density and high bandwidth. The HY57V56820C is organized as 4banks of 8,388,608x8.  
The HY57V56820C is offering fully synchronous operation referenced to a positive edge of the clock. All inputs and outputs are syn-  
chronized with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and  
output voltage levels are compatible with LVTTL.  
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutive read or write cycles initiated  
by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(sequential or interleave). A burst of  
read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a new burst  
read or write command on any cycle. (This pipelined design is not restricted by a `2N` rule.)  
FEATURES  
Single 3.3±0.3V power supply  
Auto refresh and self refresh  
All device pins are compatible with LVTTL interface  
8192 refresh cycles / 64ms  
JEDEC standard 400mil 54pin TSOP-II with 0.8mm of pin  
pitch  
Programmable Burst Length and Burst Type  
- 1, 2, 4, 8 or Full page for Sequential Burst  
- 1, 2, 4 or 8 for Interleave Burst  
All inputs and outputs referenced to positive edge of sys-  
tem clock  
Data mask function by DQM  
Internal four banks operation  
Programmable CAS Latency ; 2, 3 Clocks  
ORDERING INFORMATION  
Part No.  
Clock Frequency  
Power  
Organization  
Interface  
Package  
HY57V56820CTP-6  
HY57V56820CTP-K  
HY57V56820CTP-H  
HY57V56820CTP-8  
HY57V56820CTP-P  
HY57V56820CTP-S  
HY57V56820CLTP-6  
HY57V56820CLTP-K  
HY57V56820CLTP-H  
HY57V56820CLTP-8  
HY57V56820CLTP-P  
HY57V56820CLTP-S  
166MHz  
133MHz  
133MHz  
125MHz  
100MHz  
100MHz  
166MHz  
133MHz  
133MHz  
125MHz  
100MHz  
100MHz  
Normal  
400mil 54pin TSOP II  
Lead free  
4Banks x 8Mbits x8  
LVTTL  
Low  
power  
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any  
responsibility for use of circuits described. No patent licenses are implied.  
Rev. 0.1 / Jul. 2005  
1

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