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HY57V161610DTC-6 PDF预览

HY57V161610DTC-6

更新时间: 2024-01-17 00:33:30
品牌 Logo 应用领域
海力士 - HYNIX 存储内存集成电路光电二极管动态存储器时钟
页数 文件大小 规格书
13页 183K
描述
2 Banks x 512K x 16 Bit Synchronous DRAM

HY57V161610DTC-6 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2, TSOP50,.46,32
针数:50Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.02
风险等级:5.89访问模式:DUAL BANK PAGE BURST
最长访问时间:5.5 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):166 MHzI/O 类型:COMMON
交错的突发长度:1,2,4,8JESD-30 代码:R-PDSO-G50
长度:20.968 mm内存密度:16777216 bit
内存集成电路类型:SYNCHRONOUS DRAM内存宽度:16
功能数量:1端口数量:1
端子数量:50字数:1048576 words
字数代码:1000000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:1MX16输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSOP2
封装等效代码:TSOP50,.46,32封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE峰值回流温度(摄氏度):NOT SPECIFIED
电源:3.3 V认证状态:Not Qualified
刷新周期:4096座面最大高度:1.2 mm
自我刷新:YES连续突发长度:1,2,4,8,FP
最大待机电流:0.001 A子类别:DRAMs
最大压摆率:0.12 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.8 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:10.16 mm
Base Number Matches:1

HY57V161610DTC-6 数据手册

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HY57V161610D  
2 Banks x 512K x 16 Bit Synchronous DRAM  
DESCRIPTION  
THE Hyundai HY57V161610D is a 16,777,216-bits CMOS Synchronous DRAM, ideally suited for the main memory and graphic  
applications which require large memory density and high bandwidth. HY57V161610D is organized as 2banks of 524,288x16.  
HY57V161610D is offering fully synchronous operation referenced to a positive edge clock. All inputs and outputs are synchronized  
with the rising edge of the clock input. The data paths are internally pipelined to achieve very high bandwidth. All input and output  
voltage levels are compatible with LVTTL.  
Programmable options include the length of pipeline (Read latency of 1,2 or 3), the number of consecutive read or write cycles initi-  
ated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(sequential or interleave). A  
burst of read or write cycles in progress can be terminated by a burst terminate command or can be interrupted and replaced by a  
new burst read or write command on any cycle. (This pipeline design is not restricted by a `2N` rule.)  
FEATURES  
Auto refresh and self refresh  
Single 3.0V to 3.6V power supply  
4096 refresh cycles / 64ms  
All device pins are compatible with LVTTL interface  
Programmable Burst Length and Burst Type  
- 1, 2, 4, 8 and Full Page for Sequence Burst  
- 1, 2, 4 and 8 for Interleave Burst  
Programmable CAS Latency ; 1, 2, 3 Clocks  
JEDEC standard 400mil 50pin TSOP-II with 0.8mm of pin  
pitch  
All inputs and outputs referenced to positive edge of system  
clock  
Data mask function by UDQM/LDQM  
Internal two banks operation  
ORDERING INFORMATION  
Part No.  
Clock Frequency  
Organization  
Interface  
Package  
HY57V161610DTC-5  
HY57V161610DTC-55  
HY57V161610DTC-6  
HY57V161610DTC-7  
HY57V161610DTC-8  
HY57V161610DTC-10  
HY57V161610DTC-15  
200MHz  
183MHz  
166MHz  
143MHz  
125MHz  
100MHz  
66MHz  
400mil  
50pin TSOP II  
2Banks x 512Kbits x 16  
LVTTL  
Note :  
1. VDD(min) of HY57V161610DTC-5/55 is 3.15V  
This document is a general product description and is subject to change without notice. Hynix Semiconductor does not assume any responsibility for  
use of circuits described. No patent licenses are implied  
Rev. 4.0/Aug. 02  
1

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