HUFA76407DK8
Data Sheet
December 2001
3.5A, 60V, 0.105 Ohm, Dual N-Channel,
Logic Level UltraFET® Power MOSFET
Packaging
Features
JEDEC MS-012AA
• Ultra Low On-Resistance
BRANDING DASH
- r
- r
= 0.090Ω, VGS = 10V
= 0.105Ω, VGS = 5V
DS(ON)
DS(ON)
• Simulation Models
5
- Temperature Compensated PSPICE® and SABER™
Electrical Models
- SPICE and SABER Thermal Impedance Models
- www.fairchildsemi.com
1
2
3
4
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
Symbol
• Transient Thermal Impedance Curve vs Board Mounting
Area
SOURCE1 (1)
GATE1 (2)
DRAIN 1 (8)
DRAIN 1 (7)
• Switching Time vs R
Curves
GS
Ordering Information
SOURCE2 (3)
GATE2 (4)
DRAIN 2 (6)
DRAIN 2 (5)
PART NUMBER
PACKAGE
MS-012AA
BRAND
76407DK8
HUFA76407DK8
NOTE: When ordering, use the entire part number. Add the suffix T
to obtain the variant in tape and reel, e.g., HUFA76407DK8T.
o
Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified
A
HUFA76407DK8
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
60
60
V
V
V
DSS
DGR
Drain to Gate Voltage (R
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
±16
GS
Drain Current
o
Continuous (T = 25 C, V
A
= 5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 10V) (Figure 2) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
3.5
3.8
1.0
A
A
A
A
GS
GS
D
D
o
Continuous (T = 25 C, V
A
o
Continuous (T = 100 C, V
= 5V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 4.5V) (Figure 2) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
A
GS
D
o
Continuous (T = 100 C, V
1.0
A
GS
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Figure 4
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Figures 6, 17, 18
2.5
20
W
D
o
o
mW/ C
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
J
-55 to 150
C
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
o
300
260
C
C
L
o
pkg
NOTES:
o
o
1. T = 25 C to 125 C.
J
o
2
2
2. 50 C/W measured using FR-4 board with 0.76 in (490.3 mm ) copper pad at 1 second.
o
2
2
3. 228 C/W measured using FR-4 board with 0.006 in (3.87 mm ) copper pad at 1000 seconds.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy
of the requirements, see AEC Q101 at: http://www.aecouncil.com/
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.
©2001 Fairchild Semiconductor Corporation
HUFA76407DK8 Rev. B