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HUFA76407DK8T_NL

更新时间: 2024-11-09 13:08:27
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD 晶体小信号场效应晶体管开关光电二极管
页数 文件大小 规格书
12页 263K
描述
Small Signal Field-Effect Transistor, 3.8A I(D), 60V, 2-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, MS-012AA, LEAD FREE, MS-012AA, 8 PIN

HUFA76407DK8T_NL 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:SMALL OUTLINE, R-PDSO-G8针数:8
Reach Compliance Code:unknownECCN代码:EAR99
风险等级:5.15Is Samacsys:N
配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE最小漏源击穿电压:60 V
最大漏极电流 (ID):3.8 A最大漏源导通电阻:0.09 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:MS-012AA
JESD-30 代码:R-PDSO-G8JESD-609代码:e3
元件数量:2端子数量:8
工作模式:ENHANCEMENT MODE封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL认证状态:Not Qualified
表面贴装:YES端子面层:MATTE TIN
端子形式:GULL WING端子位置:DUAL
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

HUFA76407DK8T_NL 数据手册

 浏览型号HUFA76407DK8T_NL的Datasheet PDF文件第2页浏览型号HUFA76407DK8T_NL的Datasheet PDF文件第3页浏览型号HUFA76407DK8T_NL的Datasheet PDF文件第4页浏览型号HUFA76407DK8T_NL的Datasheet PDF文件第5页浏览型号HUFA76407DK8T_NL的Datasheet PDF文件第6页浏览型号HUFA76407DK8T_NL的Datasheet PDF文件第7页 
HUFA76407DK8  
Data Sheet  
December 2001  
3.5A, 60V, 0.105 Ohm, Dual N-Channel,  
Logic Level UltraFET® Power MOSFET  
Packaging  
Features  
JEDEC MS-012AA  
• Ultra Low On-Resistance  
BRANDING DASH  
- r  
- r  
= 0.090Ω, VGS = 10V  
= 0.105Ω, VGS = 5V  
DS(ON)  
DS(ON)  
• Simulation Models  
5
- Temperature Compensated PSPICE® and SABER™  
Electrical Models  
- SPICE and SABER Thermal Impedance Models  
- www.fairchildsemi.com  
1
2
3
4
• Peak Current vs Pulse Width Curve  
• UIS Rating Curve  
Symbol  
Transient Thermal Impedance Curve vs Board Mounting  
Area  
SOURCE1 (1)  
GATE1 (2)  
DRAIN 1 (8)  
DRAIN 1 (7)  
• Switching Time vs R  
Curves  
GS  
Ordering Information  
SOURCE2 (3)  
GATE2 (4)  
DRAIN 2 (6)  
DRAIN 2 (5)  
PART NUMBER  
PACKAGE  
MS-012AA  
BRAND  
76407DK8  
HUFA76407DK8  
NOTE: When ordering, use the entire part number. Add the suffix T  
to obtain the variant in tape and reel, e.g., HUFA76407DK8T.  
o
Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified  
A
HUFA76407DK8  
UNITS  
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
60  
60  
V
V
V
DSS  
DGR  
Drain to Gate Voltage (R  
= 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
±16  
GS  
Drain Current  
o
Continuous (T = 25 C, V  
A
= 5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
= 10V) (Figure 2) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
3.5  
3.8  
1.0  
A
A
A
A
GS  
GS  
D
D
o
Continuous (T = 25 C, V  
A
o
Continuous (T = 100 C, V  
= 5V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
= 4.5V) (Figure 2) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
A
GS  
D
o
Continuous (T = 100 C, V  
1.0  
A
GS  
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
Figure 4  
DM  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS  
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
Figures 6, 17, 18  
2.5  
20  
W
D
o
o
mW/ C  
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
J
-55 to 150  
C
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
o
300  
260  
C
C
L
o
pkg  
NOTES:  
o
o
1. T = 25 C to 125 C.  
J
o
2
2
2. 50 C/W measured using FR-4 board with 0.76 in (490.3 mm ) copper pad at 1 second.  
o
2
2
3. 228 C/W measured using FR-4 board with 0.006 in (3.87 mm ) copper pad at 1000 seconds.  
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
This product has been designed to meet the extreme test conditions and environment demanded by the automotive industry. For a copy  
of the requirements, see AEC Q101 at: http://www.aecouncil.com/  
Reliability data can be found at: http://www.fairchildsemi.com/products/discrete/reliability/index.html.  
All Fairchild semiconductor products are manufactured, assembled and tested under ISO9000 and QS9000 quality systems certification.  
©2001 Fairchild Semiconductor Corporation  
HUFA76407DK8 Rev. B  

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