Datasheet > HSS-B20-053H-01

HSS-B20-053H-01

更新时间： 2024-01-06 09:37:40

品牌	Logo	应用领域
CUI		PC
页数	文件大小	规格书
3页	280K
描述
Stamped Heat Sink, TO-220, Aluminum, PCB, 5.3 mm Horizontal Solder Pin

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中文翻译

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技术参数
数据手册

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HSS-B20-053H-01 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	Reach Compliance Code：	compliant
风险等级：	1.57	Base Number Matches：	1

HSS-B20-053H-01 数据手册

For more information, please visit the product page.

date 03/31/2017

page 1 of 3

MODEL: HSS-B20-053H-01 │ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• round hole for component attachment

• solder pins for secure PCB mounting

• black anodized finish

thermal resistance¹

power

MODEL

dissipation¹

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

HSS-B20-053H-01

15.79

20.27

5.83

4.22

4.75

Note:

1. See performance curves for full thermal resistance details.

PERFORMANCE CURVES

100

Without Airflow

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

200 LFM

400 LFM

Power

(W)

Natural

Conv.

200 LFM

400 LFM

20.27

35.97

50.37

65.25

79.19

5.83

4.22

11.51

17.06

22.79

28.53

8.34

12.42

16.41

20.60

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

Heat Dissipated (W)

cui.com

12 3

中文翻译

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