Datasheet > HSS-B20-061H-03

HSS-B20-061H-03

更新时间： 2024-02-07 08:22:15

品牌	Logo	应用领域
CUI		PC
页数	文件大小	规格书
3页	246K
描述
Stamped Heat Sink, TO-220, Aluminum, PCB, 6.1 mm Horizontal Solder Pin

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中文翻译

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技术参数
数据手册

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HSS-B20-061H-03 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	Reach Compliance Code：	compliant
风险等级：	1.59	Base Number Matches：	1

HSS-B20-061H-03 数据手册

For more information, please visit the product page.

date 03/29/2017

page 1 of 3

MODEL: HSS-B20-061H-03 │ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• solder pin for secure PCB mounting

• black anodized finish

• aluminum

thermal resistance¹

power

MODEL

dissipation¹

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

HSS-B20-061H-03

25.86

31.07

5.72

4.10

2.90

Note:

1. See performance curves for full thermal resistance details.

PERFORMANCE CURVES

100

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

Without Airflow

200 LFM

400 LFM

Power

(W)

Natural

Conv.

200 LFM

400 LFM

31.07

54.97

77.04

95.24

110.74

5.72

4.10

12.61

19.56

27.21

34.70

8.99

14.04

19.43

24.50

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

Dissipated Power (W)

cui.com

12 3

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