Datasheet > HSS-B20-0635H-01

HSS-B20-0635H-01

更新时间： 2024-02-13 19:01:13

品牌	Logo	应用领域
CUI		PC
页数	文件大小	规格书
4页	359K
描述
solder pin for secure PCB mounting

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中文翻译

获取价格

数据手册

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HSS-B20-0635H-01 数据手册

For more information, please visit the product page.

date 03/29/2017

page 1 of 4

SERIES: HSS-B20-0635 │ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• solder pin for secure PCB mounting

• round hole for component attachment

• black anodized finish

thermal resistance¹

power

MODEL

dissipation¹

ﬁn height

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

(mm)

6.35

HSS-B20-0635H

28.85

27.78

29.09

35.46

33.93

33.89

10.68

9.51

7.88

6.84

6.81

2.60

2.70

2.58

HSS-B20-0635H-01

HSS-B20-0635H-02

9.53

12.70

10.49

Note:

1. See performance curves for full thermal resistance details.

PERFORMANCE CURVES

HSS-B20-0635H

100

Without Airflow

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

200 LFM

400 LFM

Power

(W)

Natural

Conv.

200 LFM

400 LFM

35.46

59.42

83.82

101.40

122.52

10.68

20.81

31.59

41.80

52.02

7.88

15.77

23.83

31.52

38.83

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

Dissipated Power (W)

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