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HSS-B20-NP PDF预览

HSS-B20-NP

更新时间: 2024-02-24 01:24:36
品牌 Logo 应用领域
CUI /
页数 文件大小 规格书
3页 319K
描述
slide in style for easy component attachment

HSS-B20-NP 数据手册

 浏览型号HSS-B20-NP的Datasheet PDF文件第2页浏览型号HSS-B20-NP的Datasheet PDF文件第3页 
For more information, please visit the product page.  
date 03/29/2017  
page 1 of 3  
SERIES: HSS-B20-01 DESCRIPTION: HEAT SINK  
FEATURES  
• TO-220 package  
• available with and without solder pin  
• slide in style for easy component attachment  
• black anodized finish  
solder pin  
thermal resistance1  
power  
MODEL  
dissipation1  
orientation  
length  
@ 75°C ΔT,  
nat conv  
(°C/W)  
@ 1 W,  
nat conv  
(°C/W)  
@ 1 W,  
200 LFM  
(°C/W)  
@ 1 W,  
400 LFM  
(°C/W)  
@ 75°C ΔT,  
nat conv  
(W)  
(mm)  
6.1  
9.53  
6.5  
--  
HSS-B20-061H  
HSS-B20-0953H  
HSS-B20-065V  
HSS-B20-NP  
horizontal  
horizontal  
vertical  
18.63  
18.63  
18.63  
18.63  
23.05  
23.05  
23.05  
23.05  
5.01  
5.01  
5.01  
5.01  
4.01  
4.01  
4.01  
4.01  
4.02  
4.02  
4.02  
4.02  
no pin  
Note:  
1. See performance curves for full thermal resistance details.  
PERFORMANCE CURVES  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
Heatsink Temperature Rise Above  
Ambient (ΔT = Ths - Ta) (°C)  
Without Airflow  
200 LFM  
400 LFM  
Power  
(W)  
Natural  
Conv.  
200 LFM  
400 LFM  
0
1
2
3
4
5
0
0
0
23.05  
42.19  
57.90  
74.85  
88.08  
5.01  
4.01  
9.68  
7.89  
14.39  
18.96  
23.63  
11.64  
15.57  
19.26  
Ths: “hot spot” temperature measured on the heatsink  
Ta: ambient temperature  
0
1
2
3
4
5
Heat Dissipated (W)  
cui.com  

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