Datasheet > HSS-B20-061H-02

HSS-B20-061H-02

更新时间： 2024-02-03 05:21:55

品牌	Logo	应用领域
CUI		/
页数	文件大小	规格书
3页	308K
描述
slide in style for easy component attachment

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中文翻译

获取价格

数据手册

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HSS-B20-061H-02 数据手册

For more information, please visit the product page.

date 03/29/2017

page 1 of 3

SERIES: HSS-B20-07 │ DESCRIPTION: HEAT SINK

FEATURES

• TO-220 package

• available with and without solder pin

• slide in style for easy component attachment

• black anodized finish

solder pin

thermal resistance¹

power

MODEL

dissipation¹

orientation

length

@ 75°C ΔT,

nat conv

(°C/W)

@ 1 W,

nat conv

(°C/W)

@ 1 W,

200 LFM

(°C/W)

@ 1 W,

400 LFM

(°C/W)

@ 75°C ΔT,

nat conv

(W)

(mm)

6.1

9.53

6.5

HSS-B20-061H-02

HSS-B20-0953H-02

HSS-B20-065V-02

HSS-B20-NP-10

horizontal

vertical

25.92

30.86

7.24

6.25

2.89

no pin

Note:

1. See performance curves for full thermal resistance details.

PERFORMANCE CURVES

100

Without Airflow

Heatsink Temperature Rise Above

Ambient (ΔT = Ths - Ta) (°C)

200 LFM

400 LFM

Power

(W)

Natural

Conv.

200 LFM

400 LFM

30.86

55.34

75.79

95.80

109.77

7.24

6.25

14.06

21.12

28.34

35.58

11.16

16.22

21.52

26.70

Ths: “hot spot” temperature measured on the heatsink

Ta: ambient temperature

Heat Dissipated (W)

cui.com

12 3

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