HSMD-S670

更新时间： 2024-11-11 04:22:19

品牌	Logo	应用领域
安捷伦 - AGILENT		/
页数	文件大小	规格书
11页	205K
描述
High Performance Surface Mount Chip LEDs

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中文翻译

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数据手册

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HSMD-S670 数据手册

High Performance Surface Mount

Chip LEDs

Technical Data

SunPower Series

HSMx-S660 Series

HSMx-S670 Series

HSMx-S690 Series

Features

Description

• High Brightness AlInGaP

Material

These chip-type LEDs utilize

aluminum indium gallium

phosphide (AlInGaP) material

technology. The AlInGaP material

has a very high luminous

efficiency, capable of producing

high light output over a wide

range of drive currents. The 590

nm amber, 605 nm orange, and

626 nm red colors are available

in three compact, low profile

packages.

• Industry Standard 2.00 x

1.25 mm Package

• Industry Standard 1.6 x 0.8

mm (Low Profile) Package

• Right Angle Package

• Three Colors Available

• Diffused Optics

• Compatible with IR Solder

Process

applications. The HSMx-S660

right angle, 3.0 x 2.0 x 1.0 mm

LED is optimum for side lighting

applications where direct back-

lighting is not practical.

• Available in 8 mm Tape on

7” (178 mm) Diameter Reels

The HSMx-S670 is the industry

standard 2.0 x 1.25 mm package,

and is an excellent all around

package. The HSMx-S690 is the

industry standard 1.6 x 0.8 mm

package. Its low 0.7 mm profile

and wide viewing angle make this

LED excellent for backlighting

Applications

• Keypad Backlighting

• LCD Backlighting

• Symbol Backlighting

• Front Panel Indicator

All packages are compatible with

IR and convective reflow solder-

ing processes.

Device Selection Guide

Footprint

(mm) ^[1][2]

Amber

590 nm

Orange

605 nm

Red

626 nm

1.6 x 0.8 x 0.7

2.0 x 1.25 x 0.8

3.0 x 2.0 x 1.0

HSMA-S690

HSMA-S670

HSMA-S660

HSMD-S690

HSMD-S670

HSMD-S660

HSMC-S690

HSMC-S670

HSMC-S660

Notes:

1. Dimensions in mm.

2. Tolerance ± 0.1 mm unless otherwise noted.

12 3 4 5 6 7...11

中文翻译

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