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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| HS60108100J0G | AMPHENOL |
获取价格 |
Barrier Strip Terminal Block |
|
| HS60109000J0G | AMPHENOL |
获取价格 |
Barrier Strip Terminal Block |
|
| HS6010C000J0G | AMPHENOL |
获取价格 |
Barrier Strip Terminal Block |
|
| HS601-30MHZ | ETC |
获取价格 |
Peripheral IC |
|
| HS601-64.9MHZ | ETC |
获取价格 |
Peripheral IC |
|
| HS601-SERIES | ETC |
获取价格 |
Peripheral IC |
|
| HS6022E | FOXCONN |
获取价格 |
Board Connector, 44 Contact(s), 2 Row(s), Male, Straight, Surface Mount Terminal, ROHS COM |
|
| HS6022F | FOXCONN |
获取价格 |
Board Connector, 44 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount |
|
| HS6022H | FOXCONN |
获取价格 |
Board Connector, 44 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount |
|
| HS6022V | FOXCONN |
获取价格 |
Board Connector, 44 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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