Datasheet > HP1-T06-B

HP1-T06-B

更新时间： 2024-11-12 03:42:27

品牌	Logo	应用领域
西迪斯 - CTS		半导体
页数	文件大小	规格书
7页	541K
描述
METAL CASE, CASE-MOUNTED SEMICONDUCTORS

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HP1-T06-B 数据手册

Series HP1

Technical

METAL CASE, CASE-MOUNTED

SEMICONDUCTORS

HP1 Series for Single TO-3 or Stud Mount Devices

DESCRIPTION OF CURVES

A. N.C. Horiz. Device

Only Mounted to G-10.

A. N.C. Horiz. & Vert.

With Dissipator.

B. 200 RPM w/Diss.

C. 500 RPM w/Diss.

E. 1000 RPM w/Diss.

•

Thermal Resistance Case to Sink is 0.1-0.3 °C/W w/Joint Compound.

Derate 1.0 °C/watt for unplated part in natural convection only.

Ordering Information

IERC PART NO.

Semiconductor

Accommodated

Hole patt.

Ref. No.

(see pg.

1-28)

Max. Weight

(Grams)

Unplated

Comm’l. Black

Anodize

Mil. Black

Anodize

HP1-000-U

HP1-000-CB

HP1-000-B

HP1-TO3-B

HP1-TO3-33B

HP1-TO3-44B

HP1-436-B

HP1-T06-B

HP1-TO15-B

HP1-420-B

Undrilled

TO-3

TO-3 IC

TO-3 panel mount

TO-3 (4-pin)

TO-6, TO-36

TO-15, DO-5

Universal

35.0

HP1-TO3-U

HP1-TO3-33U

HP1-TO3-44U

HP1-436-U

HP1-TO6-U

HP1-TO15-U

HP1-420-U

HP1-TO3-CB

HP1-TO3-33CB

HP1-TO3-44CB

HP1-436-CB

HP1-T06-CB

HP1-TO15-CB

HP1-420-CB

12 3 4 5 6 7

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