Datasheet > HMC8108LC5TR-R5

HMC8108LC5TR-R5

更新时间： 2022-06-24 15:41:22

品牌	Logo	应用领域
亚德诺 - ADI		/
页数	文件大小	规格书
18页	430K
描述
9 GHz to 10 GHz, X-Band, GaAs, MMIC, Low Noise Converter

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HMC8108LC5TR-R5 数据手册

Data Sheet

HMC8108

directly to the ground plane. A sufficient number of via holes

EVALUATION BOARD INFORMATION

connect the top and bottom ground planes. The full evaluation

circuit board shown in Figure 58 is available from Analog Devices,

Inc., upon request.

RF circuit design techniques were implemented for the evaluation

board PCB shown in Figure 58. Signal lines have 50 Ω impedance,

and the package ground leads and exposed pad are connected

Figure 58. EV1HMC8108LC5 Evaluation PCB Top Layer

Table 5. Bill of Material for the EV1HMC8108LC5 Evaluation PCB

Reference Designator

Quantity

Description

600-01494-00-1

J1, J2

J3, J7

J5, J6

C2 to C12

C13 to C16, C18 to C21

C22 to C29

C30 to C32

L1 to L3

Evaluation board PCB; circuit board material: Rogers 4350 or Arlon 25FR

SMA connectors, SRI

SMA connectors, Johnson

Connector header, 2 mm ,12-position vertical, SMT

Terminal strips, single row, 3-pin, SMT

Ceramic capacitor, 0.5 pF, 50 V, C0G, 0402

Ceramic capacitors, 0.6 pF, 0.1 pF, 50 V, C0G, 0402

Ceramic capacitors, 1 nF, 50 V, X7R, 0402

Ceramic capacitors, 10 nF, 50 V, 10%, X7R, 0402

Ceramic capacitors, 100 nF, 16 V, 10%, X7R, 0402

Inductors, 5.6 nH, 0402, 5%, 760 mA

TP1 to TP3

Test points, PC compact, SMT

Device under test (DUT), HMC8108LC5

Rev. 0 | Page 17 of 18

1...14 15 161718

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