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HMC652 PDF预览

HMC652

更新时间: 2024-01-22 01:03:09
品牌 Logo 应用领域
HITTITE 射频和微波射频衰减器微波衰减器
页数 文件大小 规格书
8页 339K
描述
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz

HMC652 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Transferred包装说明:DIE OR CHIP
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.7Is Samacsys:N
标称衰减:2 dB特性阻抗:50 Ω
构造:COMPONENT最大输入功率 (CW):26.99 dBm
JESD-609代码:e4最大工作频率:50000 MHz
最小工作频率:最高工作温度:85 °C
最低工作温度:-55 °C封装等效代码:DIE OR CHIP
射频/微波设备类型:FIXED ATTENUATOR子类别:RF/Microwave Attenuators
技术:GAAS端子面层:Gold (Au)
Base Number Matches:1

HMC652 数据手册

 浏览型号HMC652的Datasheet PDF文件第2页浏览型号HMC652的Datasheet PDF文件第3页浏览型号HMC652的Datasheet PDF文件第4页浏览型号HMC652的Datasheet PDF文件第6页浏览型号HMC652的Datasheet PDF文件第7页浏览型号HMC652的Datasheet PDF文件第8页 
HMC650 TO HMC658  
v01.0308  
WIDEBAND FIXED ATTENUATOR FAMILY, DC - 50 GHz  
HMC650 / 651 / 652 / 653 / 654 / 655 / 656 / 657 / 658  
Outline Drawing  
HMC650, HMC652, HMC653, HMC654, HMC655, HMC656 HMC657  
2
Die Packaging Information [1]  
Standard  
Alternate  
GP-5 (Gel Pack)  
[2]  
[1] Refer to the “Packaging Information” section for die  
packaging dimensions.  
[2] For alternate packaging information contact Hittite  
Microwave Corporation.  
NOTES:  
1. ALL DIMENSIONS ARE IN INCHES (MILLIMETERS).  
2. TYPICAL BOND PAD IS .004” SQUARE.  
3. TYPICAL BOND PAD SPACING IS .006” CENTER TO  
CENTER EXCEPT AS NOTED.  
4. BACKSIDE METALIZATION: GOLD  
5. BACKSIDE METAL IS GROUND  
6. BOND PAD METALIZATION: GOLD  
7. DO NOT BOND ON TOP OF GROUND VIAS  
8. OVERALL DIE SIZE 0.002”  
Outline Drawing  
HMC651 & HMC658  
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:  
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373  
Order On-line at www.hittite.com  
2 - 6  

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