HMC6380LC4B
v03.1118
WIDEBAND MMIC VCO WITH BUFFER AMPLIFIER
8.0 - 16.0 GHz
Typical Supply Current vs. Vcc, +25C
Absolute Maximum Ratings
Vcc (V)
Icc (mA)
Vcc
+5.5 V
4.75
69
Vtune
-0.5V to +25V
-65 °C to +150 °C
Claꢀꢀ 1A
5.0
75
storage Temperature
EsD senꢀitivity (HBM)
EsD senꢀitivity (FICDM)
5.25
79
Claꢀꢀ C3
Reliability Information
Junction Temperature To Maintain
1 Million Hour MTTF
135 °C
Nominal Junction Temperature
(T = 85 °C)
121.3 °C
Thermal Reꢀiꢀtance
(Junction to expoꢀed paddle, 5V
ꢀupply)
97 °C/W
Operating Temperature
-40 °C to + 85 °C
Outline Drawing
4.05
3.90 SQ
3.75
0.36
0.30
0.24
PIN 1
PIN 1
INDICATOR
AREA
0.08
REF
24
19
18
1
0.50
BSC
2.60
2.50 SQ
2.40
EXPOSED
PAD
13
6
12
7
0.38
0.32
0.26
0.20
MIN
BOTTOM VIEW
2.50 REF
TOP VIEW
SIDE VIEW
1.20
1.10
1.00
3.10 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SEATING
PLANE
SECTION OF THIS DATA SHEET.
24-Terminal Ceramic Leadleꢀꢀ Chip Carrier [LCC]
(E-24-2)
Dimenꢀionꢀ ꢀhown in millimeterꢀ.
NOTEs:
1. PACKAGE BODY MATERIAL: ALUMINA
2. LEAD AND GROUND PADDLE PLATING: 30-80 MICROINCHEs GOLD OVER 50
MICROINCHEs MINIMUM, NICKEL.
3. DIMENsIONs ARE IN INCHEs [MILLIMETERs]
3. LEAD sPACING TOLERANCE Is NON-CUMULATIVE.
5. PACKAGE WARP sHALL NOT EXCEED 0.05mm.
6. ALL GROUND LEADs AND GROUND PADDLE MUsT BE sOLDERED TO PCB RF GROUND.
Package Information
Part Number
Package Body Material
Lead Finiꢀh
MsL Rating
MsL3 [1]
Package Marking [2]
Gold Flaꢀh Over
Nickel
H6380
XXXX
HMC6380LC4B
RoHs-compliant Ceramic sMT Package
[1] Max peak reflow temperature of 260 °C
[2] 4-Digit lot number XXXX
For price, delivery, and to place orders: Analog Devices, Inc., One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
Phone: 781-329-4700 • Order online at www.analog.com
3
Application Support: Phone: 1-800-ANALOG-D