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HM6AQB9404BPL60 PDF预览

HM6AQB9404BPL60

更新时间: 2024-12-01 15:34:11
品牌 Logo 应用领域
瑞萨 - RENESAS 静态存储器内存集成电路
页数 文件大小 规格书
26页 275K
描述
4MX9 QDR SRAM, 0.5ns, PBGA165, 15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165

HM6AQB9404BPL60 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Contact Manufacturer零件包装代码:BGA
包装说明:15 X 17 MM, 1 MM PITCH, PLASTIC, FBGA-165针数:165
Reach Compliance Code:unknownECCN代码:3A991.B.2.A
HTS代码:8542.32.00.41风险等级:5.87
最长访问时间:0.5 nsJESD-30 代码:R-PBGA-B165
JESD-609代码:e0长度:17 mm
内存密度:37748736 bit内存集成电路类型:QDR SRAM
内存宽度:9功能数量:1
端子数量:165字数:4194304 words
字数代码:4000000工作模式:SYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:4MX9封装主体材料:PLASTIC/EPOXY
封装代码:LBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):240认证状态:Not Qualified
座面最大高度:1.46 mm最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:15 mmBase Number Matches:1

HM6AQB9404BPL60 数据手册

 浏览型号HM6AQB9404BPL60的Datasheet PDF文件第2页浏览型号HM6AQB9404BPL60的Datasheet PDF文件第3页浏览型号HM6AQB9404BPL60的Datasheet PDF文件第4页浏览型号HM6AQB9404BPL60的Datasheet PDF文件第5页浏览型号HM6AQB9404BPL60的Datasheet PDF文件第6页浏览型号HM6AQB9404BPL60的Datasheet PDF文件第7页 
HM66AQB36104/HM66AQB18204  
HM66AQB9404  
36-Mbit QDRTMII SRAM  
4-word Burst  
REJ03C0048-0100  
Rev.1.00  
Aug.23.2006  
Description  
The HM66AQB36104 is a 1,048,576-word by 36-bit, the HM66AQB18204 is a 2,097,152-word by 18-bit, and the  
HM66AQB9404 is a 4,194,304-word by 9-bit synchronous quad data rate static RAM fabricated with advanced CMOS  
technology using full CMOS six-transistor memory cell. It integrates unique synchronous peripheral circuitry and a  
burst counter. All input registers controlled by an input clock pair (K and K) and are latched on the positive edge of K  
and K. These products are suitable for applications which require synchronous operation, high speed, low voltage, high  
density and wide bit configuration. These products are packaged in 165-pin plastic FBGA package.  
Features  
1.8 V ± 0.1 V power supply for core (VDD  
1.4 V to VDD power supply for I/O (VDDQ  
DLL circuitry for wide output data valid window and future frequency scaling  
Separate independent read and write data ports with concurrent transactions  
100% bus utilization DDR read and write operation  
)
)
Four-tick burst for reduced address frequency  
Two input clocks (K and K) for precise DDR timing at clock rising edges only  
Two output clocks (C and C) for precise flight time and clock skew matching-clock and data delivered together to  
receiving device  
Internally self-timed write control  
Clock-stop capability with µs restart  
User programmable impedance output  
Fast clock cycle time: 3.0 ns (333 MHz)/3.3 ns (300 MHz)/4.0 ns (250 MHz)/5.0 ns (200 MHz)/6.0 ns (167 MHz)  
Simple control logic for easy depth expansion  
JTAG boundary scan  
Note: QDR RAMs and Quad Data Rate RAMs comprise a new family of products developed by Cypress  
Semiconductor, IDT, NEC, Samsung, and Renesas Technology Corp.  
Rev.1.00 Aug 23, 2006 page 1 of 20  

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