Datasheet > HM70

HM70

更新时间： 2024-01-09 12:56:06

品牌	Logo	应用领域
TTELEC		电阻器电感器
页数	文件大小	规格书
3页	723K
描述
High Power Shielded Low Profile Surface Mount Inductors

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HM70 技术参数

生命周期：	Active	包装说明：	AXIAL LEADED, LEADED/ROHS COMPLIANT
Reach Compliance Code：	compliant	风险等级：	5.58
Is Samacsys：	N	其他特性：	HERMETICALLY SEALED, PRECISION, STANDARD: MIL-PRF-55182
安装特点：	THROUGH HOLE MOUNT	端子数量：	2
最高工作温度：	175 °C	最低工作温度：	-65 °C
封装形状：	TUBULAR PACKAGE	包装方法：	BULK; TR
额定温度：	70 °C	电阻器类型：	FIXED RESISTOR
子类别：	Fixed Resistors	表面贴装：	NO
技术：	METAL FILM	端子形状：	WIRE
工作电压：	350 V	Base Number Matches：	1

HM70 数据手册

Electrical / Environmental



High Power Shielded Low Profile

Surface Mount Inductors

oHS

• Operating Temperature Range

• Temperature Rise, Maximum

-40°C to +180°C

50°C

Compliant

Specifications

Inductance

100kHz, 0.1V

Heating ⁽³⁾

Current

Core Loss ⁽⁴⁾

Factor

(2)

DCR ⁽¹⁾

I_sat

@ 0 Adc

@ I_sat

Ω

)

@ 25°C

Part

(

H±20%)

(

(Adc)

Number

Typ.

Min.

Typ.

Max.

∆T=50°C

Fig.

HM70-101R0LF

HM70-201R3LF

HM70-201R9LF

HM70-25R80LF

HM70-301R5LF

HM70-302R0LF

HM70-321R3LF

HM70-351R5LF

HM70-401R2LF

HM70-401R6LF

HM70-50R70LF

HM70-501R2LF

HM70-505R0LF

HM70-50100LF

HM70-601R2LF

HM70-602R0LF

1.00

1.33

1.94

0.83

1.50

2.10

1.30

1.50

1.20

1.60

0.70

1.20

5.00

10.0

1.20

2.00

0.63

0.93

1.28

0.488

0.80

1.12

0.80

0.97

0.92

0.70

1.16

1.60

0.61

1.00

1.40

1.00

1.20

1.02

1.44

0.52

0.90

4.30

8.00

1.00

1.60

2.53

3.38

4.71

1.75

2.16

3.48

2.16

4.00

1.75

2.13

1.05

1.68

6.50

12.0

1.37

2.20

2.90

3.74

5.42

2.01

2.48

4.00

2.48

4.50

1.80

2.36

1.26

2.00

8.00

15.0

1.58

2.60

9.07E-11

1.24E-10

1.51E-10

170.67

157.15

189.83

118.84

1.40E-10 183.07

1.53E-10

1.66E-10

1.35E-10

1.80E-10

1.67E-10

1.99E-10

2.21E-10

196.09

140.35

166.20

129.45

151.67

88.15

110.82

219.63

316.67

1.15

0.40

0.80

3.60

6.80

0.80

1.20

2.21E-10 108.94

2.21E-10 143.34

Notes: (1) DC resistance is measured at 25°C

(2) The saturation current (I_sat) is the current at which the inductance will be decreased by 20% from its initial (zero DC) value.

(3) The heating current is the DC current, which causes the component temperature to increase by approximately 50°C. This current is determined by

soldering the component on a typical application PCB, and then apply the current to the device for 30 minutes.

(4) Core Loss approximation is based on published core data:

Core Loss (Pfe) = K1 * (f)^1.338* (K2∆I)^2.2546

Where: core loss in watt

K1 and K2 = core loss factor

f = frequency in kHz

∆I = delta I across the component in Amp.

K2∆I = one half of the peak to peak flux density across the component in Gauss

Electrical Characteristics @ 25°C

(A) Case size 10, 20, 25, 30 & 40

2007/08 EDITION MAGNETIC COMPONENTS SELECTOR GUIDE

We reserve the right to change specifications without prior notice

www.bitechnologies.com

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