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HLMT-PL00-NT014 PDF预览

HLMT-PL00-NT014

更新时间: 2024-11-06 13:21:31
品牌 Logo 应用领域
安华高科 - AVAGO 光电
页数 文件大小 规格书
9页 70K
描述
SINGLE COLOR LED, AMBER, 1.525mm, PLASTIC PACKAGE-2

HLMT-PL00-NT014 技术参数

生命周期:Active包装说明:PLASTIC PACKAGE-2
Reach Compliance Code:unknownHTS代码:8541.40.20.00
风险等级:5.77Is Samacsys:N
颜色:AMBER配置:SINGLE
最大正向电流:0.05 A透镜类型:UNTINTED NONDIFFUSED
标称发光强度:262.5 mcd安装特点:SURFACE MOUNT
功能数量:1端子数量:2
最高工作温度:100 °C最低工作温度:-40 °C
光电设备类型:SINGLE COLOR LED总高度:2.16 mm
包装方法:TAPE AND REEL 13"峰值波长:590 nm
形状:ROUND尺寸:1.525 mm
表面贴装:YES视角:125 deg
Base Number Matches:1

HLMT-PL00-NT014 数据手册

 浏览型号HLMT-PL00-NT014的Datasheet PDF文件第2页浏览型号HLMT-PL00-NT014的Datasheet PDF文件第3页浏览型号HLMT-PL00-NT014的Datasheet PDF文件第4页浏览型号HLMT-PL00-NT014的Datasheet PDF文件第5页浏览型号HLMT-PL00-NT014的Datasheet PDF文件第6页浏览型号HLMT-PL00-NT014的Datasheet PDF文件第7页 
HLMA-Qx00, HLMA-Px00 HLMT-Px00 and HLMT-Qx00  
Subminiature High Performance AlInGaP LED Lamps  
Data Sheet  
SunPower Series  
HLMA-PF00, HLMA-PG00, HLMA-PH00, HLMA-PL00, HLMA-QF00, HLMA-QG00, HLMA-QH00,  
HLMA-QL00, HLMT-PG00, HLMT-PH00, HLMT-PL00, HLMT-QG00, HLMT-QH00, HLMT-QL00  
Description  
Features  
Subminiature flat top package  
Ideal for backlighting and light piping applications  
Flat Top Package  
The HLMX-PXXX flat top lamps use an untinted, nondif-  
fused, truncated lens to provide a wide radiation pattern  
that is necessary for use in backlighting applications. The  
flat top lamps are also ideal for use as emitters in light  
pipe applications.  
Subminiature dome package  
Nondiffused dome for high brightness  
Wide range of drive currents  
Colors: 590 nm Amber, 605 nm Orange, 615nm Red-  
dish-Orange, 622/626 nm Red, and 635 nm Red  
Dome Packages  
Ideal for space limited applications  
Axial leads  
Available with lead configurations for surface mount  
and through hole PC board mounting  
The HLMX-QXXX dome lamps use an untinted, nondif-  
fused lens to provide a high luminous intensity within a  
narrow radiation pattern.  
Lead Configurations  
Technology  
All of these devices are made by encapsulating LED chips  
on axial lead frames to form molded epoxy submini-  
ature lamp packages. A variety of package configuration  
options is available. These include special surface mount  
lead configurations, gull wing, yoke lead, or Z-bend. Right  
angle lead bends at 2.54 mm (0.100 inch) and 5.08 mm  
(0.200 inch) center spacing are available for through hole  
mounting. For more information refer to Standard SMT  
and Through Hole Lead Bend Options for Subminiature  
LED Lamps data sheet.  
These subminiature solid state lamps utilize one of the  
two newly developed aluminum indium gallium phos-  
phide (AlInGaP) LED technologies. The HLMT-Devices  
are especially effective in very bright ambient lighting  
conditions. The colors 590 nm amber, 605 nm orange,  
615nm reddish-orange, 622/626 nm red, and 635 nm red  
are available with viewing angles of 15° for the domed  
devices and 125° for the flat top devices.  

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