HIP2100
®
Data Sheet
October 21, 2004
FN4022.13
100V/2A Peak, Low Cost, High Frequency
Half Bridge Driver
Features
• Drives N-Channel MOSFET Half Bridge
The HIP2100 is a high frequency, 100V Half Bridge
N-Channel power MOSFET driver IC. The low-side and
high-side gate drivers are independently controlled and
matched to 8ns. This gives the user maximum flexibility in
dead-time selection and driver protocol. Undervoltage
protection on both the low-side and high-side supplies force
the outputs low. An on-chip diode eliminates the discrete
diode required with other driver ICs. A new level-shifter
topology yields the low-power benefits of pulsed operation
with the safety of DC operation. Unlike some competitors,
the high-side output returns to its correct state after a
momentary undervoltage of the high-side supply.
• SOIC, EPSOIC, QFN and DFN Package Options
• SOIC, EPSOIC and DFN Packages Compliant with 100V
Conductor Spacing Guidelines of IPC-2221
• Pb-Free Product Available (RoHS Compliant)
• Bootstrap Supply Max Voltage to 114VDC
• On-Chip 1Ω Bootstrap Diode
• Fast Propagation Times for Multi-MHz Circuits
• Drives 1000pF Load with Rise and Fall Times Typ. 10ns
• CMOS Input Thresholds for Improved Noise Immunity
• Independent Inputs for Non-Half Bridge Topologies
• No Start-Up Problems
Ordering Information
TEMP.
PKG.
PART #
HIP2100IB
RANGE (°C)
PACKAGE
DWG. #
• Outputs Unaffected by Supply Glitches, HS Ringing Below
Ground, or HS Slewing at High dv/dt
-40 to 125 8 Ld SOIC
M8.15
• Low Power Consumption
• Wide Supply Range
HIP2100IBZ (Note 1) -40 to 125 8 Ld SOIC (Pb-free) M8.15
HIP2100EIB
-40 to 125 8 Ld EPSOIC
M8.15C
M8.15C
HIP2100EIBZ
(Note 1)
-40 to 125 8 Ld EPSOIC
(Pb-free)
• Supply Undervoltage Protection
• 3Ω Driver Output Resistance
• QFN/DFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
HIP2100IR
-40 to 125 16 Ld 5x5 QFN
L16.5x5
L16.5x5
HIP2100IRZ (Note 1) -40 to 125 16 Ld 5x5 QFN
(Pb-free)
HIP2100IR4
-40 to 125 12 Ld 4x4 DFN
L12.4x4A
L12.4x4A
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
HIP2100IR4Z
(Note 1)
-40 to 125 12 Ld 4x4 DFN
(Pb-free)
Applications
NOTES:
1. Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak
reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020C.
• Telecom Half Bridge Power Supplies
• Avionics DC-DC Converters
• Two-Switch Forward Converters
• Active Clamp Forward Converters
2. Add “T” suffix for Tape and Reel packing option.
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Copyright © Intersil Americas Inc. 2004. All Rights Reserved.
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