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HH80552PG0882M PDF预览

HH80552PG0882M

更新时间: 2024-01-23 19:59:47
品牌 Logo 应用领域
英特尔 - INTEL 时钟外围集成电路
页数 文件大小 规格书
108页 3293K
描述
Microprocessor, 32-Bit, 3200MHz, CMOS, PBGA775, FLIP CHIP, LGA-775

HH80552PG0882M 技术参数

生命周期:Active零件包装代码:LGA
包装说明:LGA,针数:775
Reach Compliance Code:unknown风险等级:5.79
地址总线宽度:36位大小:32
边界扫描:YES最大时钟频率:200 MHz
外部数据总线宽度:64格式:FLOATING POINT
集成缓存:YESJESD-30 代码:S-PBGA-B775
长度:37.5 mm低功率模式:YES
端子数量:775封装主体材料:PLASTIC/EPOXY
封装代码:LGA封装形状:SQUARE
封装形式:GRID ARRAY认证状态:COMMERCIAL
座面最大高度:4.15 mm速度:3200 MHz
最大供电电压:1.3 V最小供电电压:1.2 V
表面贴装:YES端子形式:BUTT
端子位置:BOTTOM宽度:37.5 mm
uPs/uCs/外围集成电路类型:MICROPROCESSORBase Number Matches:1

HH80552PG0882M 数据手册

 浏览型号HH80552PG0882M的Datasheet PDF文件第3页浏览型号HH80552PG0882M的Datasheet PDF文件第4页浏览型号HH80552PG0882M的Datasheet PDF文件第5页浏览型号HH80552PG0882M的Datasheet PDF文件第7页浏览型号HH80552PG0882M的Datasheet PDF文件第8页浏览型号HH80552PG0882M的Datasheet PDF文件第9页 
Contents  
Tables  
1-1 References .................................................................................................................................15  
2-1 Voltage Identification Definition ..................................................................................................19  
2-2 Absolute Maximum and Minimum Ratings .................................................................................21  
2-3 Voltage and Current Specification..............................................................................................22  
2-4 V Static and Transient Tolerance for 775_VR_CONFIG_05A Processors.............................24  
CC  
2-5 V Overshoot Specifications ....................................................................................................26  
CC  
2-6 FSB Signal Groups.....................................................................................................................28  
2-7 Signal Characteristics.................................................................................................................29  
2-8 Signal Reference Voltages.........................................................................................................29  
2-9 GTL+ Signal Group DC Specifications .......................................................................................30  
2-10GTL+ Asynchronous Signal Group DC Specifications ...............................................................30  
2-11PWRGOOD and TAP Signal Group DC Specifications..............................................................31  
2-12VTTPWRGD DC Specifications..................................................................................................31  
2-13BSEL[2:0] and VID[5:0] DC Specifications.................................................................................32  
2-14BOOTSELECT DC Specifications..............................................................................................32  
2-15GTL+ Bus Voltage Definitions ....................................................................................................33  
2-16Core Frequency to FSB Multiplier Configuration........................................................................34  
2-17BSEL[2:0] Frequency Table for BCLK[1:0].................................................................................35  
2-18Front Side Bus Differential BCLK Specifications........................................................................37  
3-1 Processor Loading Specifications ..............................................................................................43  
3-2 Package Handling Guidelines ....................................................................................................43  
3-3 Processor Materials....................................................................................................................44  
4-1 Alphabetical Land Assignments .................................................................................................50  
4-2 Numerical Land Assignment.......................................................................................................60  
4-3 Signal Description (Sheet 1 of 9)................................................................................................70  
5-1 Processor Thermal Specifications..............................................................................................80  
5-2 Thermal Profile for Processors with PRB = 0 .............................................................................81  
5-3 Thermal “Diode” Parameters using Diode Model .......................................................................86  
5-4 Thermal “Diode” Parameters using Transistor Model.................................................................86  
5-5 Thermal “Diode” n  
and Diode_Correction_Offset ..................................................................87  
trim  
5-6 Thermal Diode Interface.............................................................................................................87  
6-1 Power-On Configuration Option Signals.....................................................................................89  
7-1 Fan Heatsink Power and Signal Specifications..........................................................................96  
8-1 TMA Power and Signal Specifications......................................................................................104  
8-2 TMA Set Points for 3-wire operation of BTX Type I and Type II Boxed Processors ................107  
§
6
Datasheet  

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