Contents
5.1.2 Thermal Metrology.................................................................................................82
Processor Thermal Features ..............................................................................................82
5.2.1 Thermal Monitor.....................................................................................................82
5.2.2 Thermal Monitor 2..................................................................................................83
5.2.3 On-Demand Mode .................................................................................................84
5.2.4 PROCHOT# Signal................................................................................................85
5.2.5 THERMTRIP# Signal.............................................................................................85
5.2
5.2.6
T
and Fan Speed Reduction....................................................................85
CONTROL
5.2.7 Thermal Diode .......................................................................................................85
6
Features.....................................................................................................................................89
6.1
6.2
Power-On Configuration Options........................................................................................89
Clock Control and Low Power States .................................................................................90
6.2.1 Normal State..........................................................................................................90
6.2.2 HALT and Enhanced HALT Powerdown States ....................................................90
6.2.2.1 HALT Powerdown State.........................................................................91
6.2.2.2 Enhanced HALT Powerdown State .......................................................91
6.2.3 Stop Grant State....................................................................................................92
6.2.4 Enhanced HALT Snoop or HALT Snoop State,
Stop Grant Snoop State.........................................................................................92
6.2.4.1 HALT Snoop State, Stop Grant Snoop State.........................................92
6.2.4.2 Enhanced HALT Snoop State................................................................92
7
Boxed Processor Specifications.....................................................................................93
7.1
Mechanical Specifications ..................................................................................................93
7.1.1 Boxed Processor Cooling Solution Dimensions ....................................................93
7.1.2 Boxed Processor Fan Heatsink Weight.................................................................95
7.1.3 Boxed Processor Retention Mechanism and Heatsink
Attach Clip Assembly.............................................................................................95
Electrical Requirements......................................................................................................95
7.2.1 Fan Heatsink Power Supply ..................................................................................95
Thermal Specifications .......................................................................................................97
7.3.1 Boxed Processor Cooling Requirements...............................................................97
7.2
7.3
8
Balanced Technology Extended (BTX) Boxed Processor Specifications .....99
8.1
Mechanical Specifications ................................................................................................100
8.1.1 Balanced Technology Extended (BTX) Type I and
Type II Boxed Processor Cooling Solution Dimensions ......................................100
8.1.2 Boxed Processor Thermal Module Assembly Weight..........................................102
8.1.3 Boxed Processor Support and Retention Module (SRM) ....................................102
Electrical Requirements....................................................................................................103
8.2.1 Thermal Module Assembly Power Supply...........................................................103
Thermal Specifications .....................................................................................................105
8.3.1 Boxed Processor Cooling Requirements.............................................................105
8.3.2 Variable Speed Fan.............................................................................................106
8.2
8.3
9
Debug Tools Specifications............................................................................................109
9.1
Logic Analyzer Interface (LAI) ..........................................................................................109
9.1.1 Mechanical Considerations..................................................................................109
9.1.2 Electrical Considerations .....................................................................................109
4
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