Dec 2005
BVDSS = 900 V
DS(on) typ = 0.93 Ω
R
HFH11N90
900V N-Channel MOSFET
ID = 11 A
TO-3P
FEATURES
1
Originative New Design
2
3
Superior Avalanche Rugged Technology
Robust Gate Oxide Technology
Very Low Intrinsic Capacitances
Excellent Switching Characteristics
Unrivalled Gate Charge : 75 nC (Typ.)
Extended Safe Operating Area
Lower RDS(ON) : 0.93 Ω (Typ.) @VGS=10V
100% Avalanche Tested
1.Gate 2. Drain 3. Source
Absolute Maximum Ratings
TC=25℃ unless otherwise specified
Symbol
Parameter
Value
Units
V
VDSS
Drain-Source Voltage
Drain Current
900
11.0
6.9
ID
– Continuous (TC = 25℃)
– Continuous (TC = 100℃)
A
Drain Current
A
IDM
VGS
EAS
IAR
Drain Current
– Pulsed
(Note 1)
44.0
±30
960
11.0
30
A
Gate-Source Voltage
V
Single Pulsed Avalanche Energy
Avalanche Current
(Note 2)
(Note 1)
(Note 1)
(Note 3)
mJ
A
EAR
dv/dt
PD
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Power Dissipation (TC = 25℃)
mJ
V/ns
4.0
300
2.38
W
W/℃
℃
- Derate above 25℃
Operating and Storage Temperature Range
TJ, TSTG
TL
-55 to +150
Maximum lead temperature for soldering purposes,
1/8” from case for 5 seconds
300
℃
Thermal Resistance Characteristics
Symbol
Parameter
Typ.
Max.
Units
RθJC
RθCS
Junction-to-Case
Case-to-Sink
--
0.24
--
0.42
--
℃/W
Junction-to-Ambient
40
RθJA
◎ SEMIHOW REV.A0,Dec 2005