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HFG1N80 PDF预览

HFG1N80

更新时间: 2024-11-12 10:48:07
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SEMIHOW /
页数 文件大小 规格书
2页 227K
描述
800V N-Channel MOSFET

HFG1N80 数据手册

 浏览型号HFG1N80的Datasheet PDF文件第2页 
Preliminary  
Aug 2008  
BVDSS = 800 V  
RDS(on) typ = 13 Ω  
HFG1N80  
800V N-Channel MOSFET  
ID = 1.0 A  
TO-92L  
FEATURES  
Originative New Design  
Superior Avalanche Rugged Technology  
Robust Gate Oxide Technology  
Very Low Intrinsic Capacitances  
Excellent Switching Characteristics  
Unrivalled Gate Charge : 7.5 nC (Typ.)  
Extended Safe Operating Area  
Lower RDS(ON) : 13 Ω (Typ.) @VGS=10V  
1.Gate 2. Drain 3. Source  
D
G
S
Absolute Maximum Ratings  
TC=25unless otherwise specified  
Symbol  
Parameter  
Value  
Units  
V
VDSS  
Drain-Source Voltage  
Drain Current  
800  
1.0  
ID  
– Continuous (TC = 25℃)  
– Continuous (TC = 100℃)  
A
Drain Current  
0.63  
4.0  
A
IDM  
VGS  
EAS  
IAR  
Drain Current  
– Pulsed  
(Note 1)  
A
Gate-Source Voltage  
±30  
90  
V
Single Pulsed Avalanche Energy  
Avalanche Current  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
mJ  
A
1.0  
EAR  
dv/dt  
PD  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
4.5  
mJ  
V/ns  
4.0  
Power Dissipation (TA = 25) *  
Power Dissipation (TC = 25℃)  
2.5  
45  
W
W
- Derate above 25℃  
Operating and Storage Temperature Range  
0.36  
W/℃  
TJ, TSTG  
TL  
-55 to +150  
Maximum lead temperature for soldering purposes,  
1/8” from case for 5 seconds  
300  
Thermal Resistance Characteristics  
Symbol  
Parameter  
Typ.  
Max.  
Units  
RθJC  
RθJA  
Junction-to-Case  
--  
--  
--  
2.78  
Junction-to-Ambient*  
Junction-to-Ambient  
50  
℃/W  
110  
RθJA  
* When mounted on the minimum pad size recommended (PCB Mount)  
SEMIHOW REV.A0,Aug 2008  

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