SUBMINIATURE DIP RELAY
HFD2
Features
• 2 Form C contact,Polarized relay
• High sensitivity 150mW
• Fits standard 16 pin IC socket
• High switching capacity 60W,125VA
• Epoxy sealed for automatic wave soldering
and cleaning
File No.:E133481
CONTACT DATA
COIL
Sensitive standard
2C
50m
Contact Arrangement
Initial Contact Resistance
Contact Material
Single side stable 150mW
200mW
200mW
Coil power
Ag-AuAg8, AgPd60
2A 30VDC
Latching 2 coil
Latching 1 coil
150mW
75mW
Contact Rating
(Res. Load)
100mW
1A 125VAC
Temperature Rise
Coil Voltage
Max. 65• C
Max. switching power
Max. switching voltage
Max. switching current
60W, 125VA
See coil data table
220VDC, 250VAC
2A
COIL DATA
10mV 10µA
Min. Applicable load
Electrical life
Single side stable
standard(200mW) 20 C
1 x 105OPS (2A 30VDC) 5 x 105OPS (1A 30VDC)
1 x 108 OPS
Pick-up Drop-out
Voltage Voltage
allowable
Voltage
VDC
Coil
resistance
( 10%)
Nominal
Order
Number
Mechanical life
Voltage
VDC
VDC
(Max.)
VDC
(Min.)
(Max.)
CHARACTERISTICS
003-M
005-M
006-M
009-M
012-M
015-M
024-M
048-M
3
5
2.30
3.75
4.50
6.75
9.00
11.25
18.0
36.0
0.3
0.5
0.6
0.9
1.2
1.5
2.4
4.8
45
125
6
10
12
18
24
30
48
96
Initial Insulation Resistance
1000M 500VDC
1500Vrms, 1min(1coil)
1000Vrms, 1min(2coil)
1000Vrms, 1min
4ms
Contacts to coil
Dielectric
Strength
6
180
9
405
Contacts to contact
Operate time (at nomi. Volt.)
Release time (at nomi. Volt.)
Set Time (latching)
Reset Time (latching)
Bounce Time
12
15
24
48
720
3ms
1125
2880
11520
3ms
3ms
1.5ms
-40 C to +85 C
5% to 85%R.H.
Ambient temperature
Humidity
Single side stable
sensitive(150mW) 20 C
Pick-up Drop-out
Voltage Voltage
allowable
Voltage
VDC
196 m/s
2
(20g) 10 to 55Hz
490 m/s (50g)
980 m/s
Coil
resistance
( 10%)
Vibration Resistance
Nominal
Order
Number
VDC
Voltage
2
Functional
Shock
Resistance
Destructive
VDC
VDC
(Max.)
(Min.)
(Max.)
2
(100g)
003-S
005-S
006-S
009-S
012-S
015-S
024-S
3
5
2.4
4.0
0.3
0.5
0.6
0.9
1.2
1.5
2.4
60
167
7.0
11.5
13.8
20.8
27.7
34.6
55.4
2.0p
Contact to contact
Capacitance Contact set to contact
Contact to coil
1.5p
5.0p
6
4.8
240
270 C 5s
80 C 30s
DIP & PCB
Approx, 4.5g
Sealed
Max.Solder Temp. Time
Max.Solvent Temp. Time
Termination
9
7.2
540
12
15
24
9.6
960
12.0
19.2
1500
3840
Unit weight
Construction
HONGFA RELAY
ISO9001/QS9000/ISO14000 CERTIFIED
34