PD -2.451 rev. B 03/99
HFA180NH40R
Ultrafast, Soft Recovery Diode
VR = 400V
HEXFREDTM
LUG
TERMINAL
CATHODE
Features
Reduced RFI and EMI
Reduced Snubbing
VF(typ.) = 1.1V
IF(AV) = 180A
Extensive Characterization of
Recovery Parameters
Qrr (typ.) = 420nC
IRRM(typ.)= 8.7A
trr(typ.)= 45ns
a
d
BASE ANODE
di(rec)M/dt (typ.) = 280A/µs
Description
HEXFREDTM diodes are optimized to reduce losses and EMI/RFI in high frequency
power conditioning systems. An extensive characterization of the recovery
behavior for different values of current, temperature and di/dt simplifies the
calculations of losses in the operating conditions. The softness of the recovery
eliminates the need for a snubber in most applications. These devices are
ideally suited for power converters, motors drives and other applications where
switching losses are significant portion of the total losses.
HALF-PAK
Absolute Maximum Ratings (per Leg)
Parameter
Max.
Units
VR
Cathode-to-Anode Voltage
Continuous Forward Current
Continuous Forward Current
Single Pulse Forward Current
Non-Repetitive Avalanche Energy
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
400
280
138
1200
1.4
V
IF @ TC = 25°C
IF @ TC = 100°C
IFSM
A
EAS
mJ
W
PD @ TC = 25°C
PD @ TC = 100°C
TJ
521
208
-55 to +150
°C
TSTG
Storage Temperature Range
Thermal - Mechanical Characteristics
Parameter
Min.
Typ.
0.15
Max.
0.20
Units
RthJC
RthCS
Wt
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Weight
°C/W
K/W
25 (2.8)
40 (4.6)
80
26 (0.9)
g (oz)
Mounting Torque
TerminalTorque
15 (1.7)
30 (3.4)
lbfin
(Nm)
Vertical Pull
lbfin
2 inch Lever Pull
40
Note: Limited by junction temperature
L = 100µH, duty cycle limited by max TJ
125°C
Mounting surface must be smooth, flat, free or burrs or other
protrusions. Apply a thin even film or thermal grease to mounting
surface. Gradually tighten each mounting bolt in 5-10 lbfin steps
until desired or maximum torque limits are reached. Module
1