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HEDL-5500 PDF预览

HEDL-5500

更新时间: 2024-11-04 03:41:35
品牌 Logo 应用领域
安华高科 - AVAGO 光电编码器
页数 文件大小 规格书
2页 94K
描述
Motion Sensing Products, Optical Encoder Modules

HEDL-5500 数据手册

 浏览型号HEDL-5500的Datasheet PDF文件第2页 
HEDL-5500, HEDL-5600, HEDL-6500, HEDL-9x00 Series  
Motion Sensing Products, Optical Encoder Modules  
Reliability Data Sheet  
Description  
Failure Rate Prediction  
The following cumulative test results have been obtained The failure rate of semiconductor devices is determined  
from testing performed at Avago Technologies Malaysia by the junction temperature of the device. The relation-  
in accordance with the latest revisions of JEDEC standards ship between ambient temperature and actual junction  
temperature is given by the following:  
Avago tests parts at the absolute maximum rated condi-  
tions recommended for the device. The actual perfor- T (°C) = T (°C) + θ P  
J
A
JA AVG  
mance you obtain from Avago parts depends on the where T = ambient temperature in °C  
A
electrical and environmental characteristics of your appli-  
cation but will probably be better than the performance  
outlined in Table 1.  
θ
= thermal resistance of junction-to-ambient in °C/Watt  
JA  
P
AVG  
= average power dissipated in Watt  
The estimated MTTF and failure rate at temperatures  
lower than the actual stress temperature can be deter-  
mined by using an Arrhenius model for temperature  
acceleration. Results of such calculations are shown in  
the table below using an activation energy of 0.43eV  
(reference MIL-HDBK-217).  
Table 1. Life Tests  
Demonstrated Performance  
Point Typical Performance  
Total Device  
Hours  
30,000  
Units  
Tested  
Total  
Failed  
Failure Rate  
(% /1 K Hours)  
[3]  
Test Name  
Stress Test Conditions  
MTTF  
High Temperature Operating Life Vcc=5.0V, T =ꢀ00°C  
30  
0
32,700  
3.06  
A

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