生命周期: | Transferred | 零件包装代码: | QFP |
包装说明: | TFQFP, | 针数: | 64 |
Reach Compliance Code: | compliant | 风险等级: | 5.18 |
接口集成电路类型: | READ WRITE AMPLIFIER CIRCUIT | JESD-30 代码: | S-PQFP-G64 |
长度: | 10 mm | 功能数量: | 1 |
端子数量: | 64 | 最高工作温度: | 70 °C |
最低工作温度: | 封装主体材料: | PLASTIC/EPOXY | |
封装代码: | TFQFP | 封装形状: | SQUARE |
封装形式: | FLATPACK, THIN PROFILE, FINE PITCH | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压: | 5.5 V |
最小供电电压: | 4.5 V | 标称供电电压: | 5 V |
表面贴装: | YES | 技术: | BICMOS |
温度等级: | COMMERCIAL | 端子形式: | GULL WING |
端子节距: | 0.5 mm | 端子位置: | QUAD |
宽度: | 10 mm | Base Number Matches: | 1 |
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