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HCPL-5761-300 PDF预览

HCPL-5761-300

更新时间: 2024-11-05 00:01:39
品牌 Logo 应用领域
安捷伦 - AGILENT 光电
页数 文件大小 规格书
12页 167K
描述
AC/DC to Logic Interface Hermetically Sealed Optocouplers

HCPL-5761-300 数据手册

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AC/DC to Logic Interface  
Hermetically Sealed  
Optocouplers  
Technical Data  
HCPL-576X*  
5962-8947701  
*See matrix for available extensions  
Features  
Applications  
• Military and Space  
• High Reliability Systems  
• Transportation, Medical,  
and Life Critical Systems  
• Limit Switch Sensing  
• Low Voltage Detector  
• ac/dc Voltage Sensing  
• Relay Contact Monitor  
• Relay Coil Voltage Monitor  
• Current Sensing  
• Microprocessor Interface  
• Telephone Ring Detection  
• Harsh Industrial  
Environments  
Description  
• Dual Marked with Device  
Part Number and DSCC  
Standard Microcircuit  
Drawing  
• Manufactured and Tested  
on a MIL-PRF-38534  
Certified Line  
• QML-38534, Class H and K  
• Hermetically Sealed 8-pin  
Dual In-Line Packages  
• Performance Guaranteed  
over -55°C to +125°C  
• ac or dc Input  
• Programmable Sense Voltage  
• Hysteresis  
These devices are single channel,  
hermetically sealed, voltage/  
current threshold detection  
optocouplers. The products are  
capable of operation and storage  
over the full military temperature  
range and can be purchased as  
either standard product, or with  
full MIL-PRF-38534 Class Level  
H or K testing, or from the DSCC  
Standard Microcircuit Drawing  
(SMD) 5962-89477. All devices  
are manufactured and tested on  
a MIL-PRF-38534 certified line  
and are included in the DSCC  
Qualified Manufacturers List,  
QML-38534 for Hybrid  
• HCPL-3700 Operating  
Compatibility  
Schematic  
Microcircuits.  
• Logic Compatible Output  
• 1500 Vdc Withstand Test  
Voltage  
• Thresholds Guaranteed over  
Temperature  
• Thresholds Independent of  
LED Characteristics  
HCPL-5760/1/K  
The connection of a 0.1 µF bypass capacitor between pins 8 and 5 is recommended.  
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to  
prevent damage and/or degradation which may be induced by ESD.  

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