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HCPL-314J-XXXE PDF预览

HCPL-314J-XXXE

更新时间: 2024-11-07 21:55:03
品牌 Logo 应用领域
安捷伦 - AGILENT 栅极光电双极性晶体管栅极驱动
页数 文件大小 规格书
16页 420K
描述
0.4 Amp Output Current IGBT Gate Drive Optocoupler

HCPL-314J-XXXE 数据手册

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0.4 Amp Output Current  
IGBT Gate Drive Optocoupler  
Technical Data  
HCPL-314J  
Features  
Functional Diagram  
0.4 A Minimum Peak  
Description  
The HCPL-314J family of devices  
consists of an AlGaAs LED  
Output Current  
N/C  
ANODE  
1
16  
V
V
V
CC  
High Speed Response:  
0.7 µs Max. Propagation  
Delay over Temp. Range  
Ultra High CMR: Min.  
2
3
15  
14  
O
optically coupled to an integrated  
circuit with a power output stage.  
These optocouplers are ideally  
suited for driving power IGBTs  
and MOSFETs used in motor  
control inverter applications. The  
high operating voltage range of  
the output stage provides the  
drive voltages required by gate  
controlled devices. The voltage  
and current supplied by this  
optocoupler makes it ideally  
suited for directly driving small  
or medium power IGBTs. For  
IGBTs with higher ratings the  
HCPL-3150(0.5A) or HCPL-3120  
(2.0A) optocouplers can be used.  
CATHODE  
EE  
SHIELD  
10 kV/µs at V = 1.5 kV  
CM  
V
V
V
ANODE  
CATHODE  
N/C  
6
7
11  
10  
CC  
Bootstrappable Supply  
Current: Max. 3 mA  
O
Wide Operating Temp.  
Range: -40°C to 100°C  
8
9
EE  
SHIELD  
Wide V Operating Range:  
CC  
HCPL-314J  
10 V to 30 V over Temp.  
Range  
Available in DIP8 (Single)  
and SO16 (Dual) Package  
Safety Approvals: UL  
Truth Table  
LED  
V
O
Recognized, 3750 V  
for  
rms  
OFF  
ON  
LOW  
1 Minute. CSA Approval.  
IEC/EN/DIN EN 60747-5-2  
Approval VIORM=891 V  
HIGH  
peak  
Applications  
Isolated IGBT/Power  
MOSFET Gate Drive  
AC and Brushless DC Motor  
Drives  
Inverters for Appliances  
Industrial Inverters  
Switch Mode Power  
Supplies (SMPS)  
Uninterruptable Power  
Supplies (UPS)  
A 0.1 µF bypass capacitor must be connected between pins V and V  
.
EE  
CC  
CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to prevent  
damage and/or degradation which may be induced by ESD.  

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