Datasheet > HCNW4300E

HCNW4300E

更新时间： 2024-11-09 12:31:55

品牌	Logo	应用领域
安华高科 - AVAGO		光电栅驱动
页数	文件大小	规格书
21页	374K
描述
Intelligent Power Module and Gate Drive Interface Optocouplers

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数据手册

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HCNW4300E 数据手册

HCPL-4506/J456/0466, HCNW4506

Intelligent Power Module and Gate Drive Interface Optocouplers

Data Sheet

Lead (Pb) Free

RoHS 6 fully

compliant

RoHS 6 fully compliant options available;

-xxxE denotes a lead-free product

Description

Features

• Performance speciﬁed for bommon IPM applications

over industrial temperature range: -40°C to 100°C

TheHCPL-4506andHCPL-0466containaGaAsPLEDwhile

theHCPL-J456andtheHCNW4506containanAlGaAsLED.

The LED is optically coupled to an integrated high gain

photo detector. Minimized propagation delay diﬀerence

between devices makes these optocouplers excellent so-

lutions for improving inverter eﬃciency through reduced

switching dead time.

• Fast maximum propagation delays

t_PHL= 480ns

t_PLH= 550ns

• Minimized Pulse Width Distortion

PWD = 450 ns

Anonchip20kΩoutputpull-upresistorcanbeenabledby

shortingoutputpins6and7,thuseliminatingtheneedfor

an external pull-up resistor in common IPM applications.

Speciﬁcations and performance plots are given for typical

IPM applications.

• 15 kV/µs minimum common mode transient immu-

nity

at V_CM= 1500 V

• CTR > 44% at I_F= 10mA

• Safety approval:

UL Recognized

Functional Diagram

-3750 V rms / 1 min. for HCPL-4506/0466/J456

-5000 V rms / 1 min. for HCPL-4506 Option 020

and HCNW4506

20 kΩ

CSA Approved

ANODE

IEC/EN/DIN EN 60747-5-2 Approved

-V_IORM= 560 Vpeak for HCPL-0466 Option 060

-V_IORM= 630 Vpeak for HCPL-4506 Option 060

-V_IORM= 891 Vpeak for HCPL-J456

-V_IORM= 1414 Vpeak for HCNW4506

CATHODE

GND

SHIELD

Truth Table

LED

Applications

• IPM isolation

• Isolated IGBT/MOSFET gate drive

• AC and brushless DC motor drives

• Industrial inverters

OFF

The connection of a 0.1 µF bypass capacitor

between pins 5 and 8 is recommended.

CAUTION: It is advised that normal static precautions be taken in handling and assembly

of this component to prevent damage and/or degradation which may be induced by ESD.

12 3 4 5 6 7...21

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