HCC4013BEY

更新时间： 2024-11-03 22:56:59

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		/
页数	文件大小	规格书
12页	289K
描述
NAND GATES

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中文翻译

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数据手册

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HCC4013BEY 数据手册

HCC4011B/12B/23B

HCF4011B/12B/23B

NAND GATES

QUAD 2 INPUT HCC/HCF 4011B

DUAL 4 INPUT HCC/HCF 4012B

TRIPLE 3 INPUT HCC/HCF 4023B

PROPAGATION DELAY TIME = 60ns (typ.) AT

C_L= 50pF, V_DD= 10V

BUFFERED INPUTS AND OUTPUTS

QUIESCENT CURRENT SPECIFIED TO 20V

FOR HCC DEVICE

(Plastic Package)

(Ceramic Frit Seal Package)

INPUT CURRENT OF 100nA AT 18V AND 25°C

FOR HCC DEVICE

100% TESTED FOR QUIESCENT CURRENT

5V, 10V AND 15V PARAMETRIC RATINGS

MEETS ALLREQUIREMENTS OF JEDECTEN-

TATIVE STANDARD N^o. 13A, ”STANDARD

SPECIFICATIONS FOR DESCRIPTION OF ”B”

SERIES CMOS DEVICES”

(Micro Package)

(Plastic Chip Carrier)

ORDER CODES :

HCC40XXBF

HCF40XXBM1

HCF40XXBEY

HCF40XXBC1

DESCRIPTION

The HCC4011B, HCC4012B and HCC4023B (ex-

tended temperature range) and HCF4011B,

HCF4012B and HCF4023B (intermediate tempera-

ture range) are monolithic, integrated circuit, avail-

able in 14-lead dual in-line plastic or ceramic

package and plastic micropackage.

The HCC/HCF4011B, HCC/HCF4012B and

HCC/HCF4023B NAND gates provide the system

designer with direct implementation of the NAND

function and supplement the existing family of

COS/MOS gates. All inputs and outputs are buf-

fered.

PIN CONNECTIONS

4011B

4012B

4023B

June 1989

1/12

12 3 4 5 6 7...12

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