RoHS
High Current Beads
HCB05KF
inch
Dimensions:
(mm)
.062±.006
.031±.006
(1.60±0.15)
(0.8±0.15)
.031±.006
.031±.006
(0.8±0.15)
(0.8±0.15)
.037
(0.95)
.031±.006
(0.8±0.15)
.012±.008
(0.3±0.20)
.033
(0.85)
.041
(0.80)
Recommended PCB Layout
Features
• 0603 Surface mount EMI suppression
components
Allied
Part
Number
Test
DCR
Rated
Current
(mA) Max
Impedance (Ω)
Frequency
(Ω Max)
(MHz)
• High current capacity
• Wide range of impedance values
• Multi layer technology
• Flow and reflow solderable
• Halogen free
25%
HCB05KF-300-RC
HCB05KF-800-RC
HCB05KF-121-RC
HCB05KF-151-RC
HCB05KF-221-RC
HCB05KF-301-RC
HCB05KF-471-RC
HCB05KF-601-RC
30
80
100
100
100
100
100
100
100
100
0.04
0.04
0.10
0.10
0.10
0.10
0.20
0.20
3000
3000
2000
2000
2000
2000
1000
1000
120
150
220
300
470
600
Electrical
Impedance Range: 30Ω to 600Ω
Tolerance: 25% over entire range
Operating Temp: -40ºC to +125ºC
Storage Temp: -40ºC to +125ºC
Rated Current: Based on temp rise not to
exceed 30ºC.
All specifications subject to change without notice.
Resistance to Solder Heat
Reflow Solder Profile
Pre-Heat: 150ºC, 60sec
Solder Composition: Sn96.5%/Ag3% Cu0.5%
Solder Temp: 245±5ºC
Flux for lead free: Rosin 9.5%
Depth: Completely cover the termination
Dip Time: 4 ±1sec
PRE-HEATING
SOLDERING
NATURAL
COOLING
TP(260
℃ / 10s max.)
tp(245° C / 20~40s.)
Test Equipment
217
(Z): HP4291A RF Impedance/Material Analyzer
(RDC): Chen Hwa 502BC
60~150s
200
150
60~180s
Physical
Packaging: 4000pcs per 7 inch reel
Marking: None
480s max.
25
Derating Curve
TIME( sec.)
Reflow times: 3 times max
6A
6
5A
4A
3A
5
4
3
2A
2
1.5A
1A
1
0
85
125
Environment Temperature+△Temperature(°C)
www.alliedcomponents.com
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ALLIED COMPONENTS INTERNATIONAL
09/13/2017
15