RoHS
High Current Beads
HCB03 thru 05
HCB03
HCB05
Inches
(mm)
Dimensions:
0.063±0.008
(1.60±0.20)
0.039±0.006
(0.99±0.15)
0.031±0.006
(0.79±0.15)
0.020±0.006
(0.51±0.15)
0.031±0.006
(0.79±0.15)
0.020±0.006
(0.51±0.15)
0.016±0.008
(0.41±0.20)
0.010±0.006
(0.25±0.15)
0.023
(0.58)
0.016
(0.41)
0.041
(1.04)
0.018
0.031
(0.79)
0.016
(0.41)
(0.46)
Allied
Part
Number
Rated
Current
(mA)
Impedance (Ω)
@ 100 MHz
+/- 25%
DC
Resistance
(Ω) Max.
Features
• 0402 & 0603 Surface mount EMI suppression components
• Nickel barrier termination for excellent resistance to solder heat
• High current capacity
• Wide range of impedance values
• Multi layer technology
HCB03
10
30
60
0.03
0.05
.075
0.09
0.09
0.14
0.18
0.34
0.49
HCB03-100-RC
HCB03-300-RC
HCB03-600-RC
HCB03-800-RC
HCB03-121-RC
HCB03-151-RC
HCB03-221-RC
HCB03-601-RC
HCB03-102-RC
2000
1700
1500
1200
1200
900
• Low DCR
80
• Flow and reflow soldering
120
150
220
600
1000
580
Electrical
420
350
Impedance Range: HCB03 10Ω to 1000Ω
HCB05 10Ω to 1500Ω
HCB05
Tolerance: 25% over entire range
Operating Temp: -55ºC ~ +125ºC
Storage Temp: Under 25ºC at 40~60% Humidity
Rate Current: Based on temp rise not to exceed 30ºC
Rate current is derated as indicated below based on
operating temp.
10
11
0.02
0.02
0.03
0.03
0.03
0.03
0.03
0.03
0.03
0.03
.035
.035
.035
0.04
0.04
0.04
0.04
0.05
0.05
0.05
0.05
0.05
0.05
0.08
.085
.090
.095
0.10
0.12
0.12
0.12
0.12
0.15
0.15
0.15
0.20
0.25
0.25
0.25
0.25
HCB05-100-RC
HCB05-110-RC
HCB05-150-RC
HCB05-170-RC
HCB05-190-RC
HCB05-200-RC
HCB05-220-RC
HCB05-250-RC
HCB05-300-RC
HCB05-310-RC
HCB05-320-RC
HCB05-330-RC
HCB05-400-RC
HCB05-470-RC
HCB05-500-RC
HCB05-560-RC
HCB05-600-RC
HCB05-680-RC
HCB05-700-RC
HCB05-750-RC
HCB05-800-RC
HCB05-900-RC
HCB05-101-RC
HCB05-121-RC
HCB05-151-RC
HCB05-181-RC
HCB05-201-RC
HCB05-221-RC
HCB05-241-RC
HCB05-301-RC
HCB05-331-RC
HCB05-401-RC
HCB05-451-RC
HCB05-471-RC
HCB05-501-RC
HCB05-601-RC
HCB05-701-RC
HCB05-751-RC
HCB05-801-RC
HCB05-102-RC
HCB05-152-RC
4000
4000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
3000
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
1500
1500
1500
1500
1500
1500
1200
1000
800
15
17
19
20
22
25
30
31
32
33
40
47
50
56
60
Resistance to Solder Heat
68
70
Pre-Heat 150ºC, 1 minute
75
80
Solder Composition: Sn/Ag3.0/Cu0.5
Solder Temp: 260±5ºC for 10sec ±1 sec.
Minimum of 75% of Electrode covered with new solder.
Impedance within 30% of initial value.
90
100
120
150
180
200
220
240
300
330
400
450
470
500
600
700
750
800
1000
1500
Test Equipment
(Z): HP4291A RF Impedance/Material Analyzer
(RDC): Chen Hwa 502BC
Physical
800
Packaging: HCB03 - 10000 per 7 inch reel.
800
HCB05 - 4000 per 7 inch reel.
800
500
0.40
Marking: None
All specifications subject to change without notice.
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949-356-1780
ALLIED COMPONENTS INTERNATIONAL
REVISED 09/22/2014
15