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| 型号 | 品牌 | 获取价格 | 描述 | 数据表 |
| HB0830-2R5605-R | COOPER |
获取价格 |
Supercapacitors HB Series |
|
| HB08377 | FOXCONN |
获取价格 |
Board Connector, 37 Contact(s), 1 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, |
|
| HB08418100J0G | AMPHENOL |
获取价格 |
Barrier Strip Terminal Block, |
|
| HB-090-0185 | NUVOTEM TALEMA |
获取价格 |
High Current Inductors |
|
| HB09112100J0G | AMPHENOL |
获取价格 |
Barrier Strip Terminal Block |
|
| HB09114100J0G | AMPHENOL |
获取价格 |
Barrier Strip Terminal Block |
|
| HB09418100J0G | AMPHENOL |
获取价格 |
Barrier Strip Terminal Block, |
|
| HB0C4M-EU | DIALIGHT |
获取价格 |
DuroSite? Series LED High Bay Luminaire - CE Approved |
|
| HB0C4M-EUD | DIALIGHT |
获取价格 |
DuroSite? Series LED High Bay Luminaire - CE Approved |
|
| HB0C4M-EUOS | DIALIGHT |
获取价格 |
DuroSite? Series LED High Bay Luminaire - CE Approved |
|
英伟达新AI芯片Rubin或提前半年亮相
苹果iPhone 17将全系采用三星/LG显示LTPO OLED面板
三星深化印度制造布局，供应链本地化进程加速
芯擎科技“星辰一号”自动驾驶芯片点亮成功，2025年量产在即
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