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GVT71512ZC18-5 PDF预览

GVT71512ZC18-5

更新时间: 2024-01-31 11:21:30
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 时钟静态存储器内存集成电路
页数 文件大小 规格书
31页 542K
描述
ZBT SRAM, 512KX18, 3.2ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100

GVT71512ZC18-5 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:14 X 20 MM, 1.40 MM HEIGHT, PLASTIC, TQFP-100
针数:100Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
风险等级:5.92最长访问时间:3.2 ns
其他特性:PIPELINED ARCHITECTURE最大时钟频率 (fCLK):200 MHz
I/O 类型:COMMONJESD-30 代码:R-PQFP-G100
JESD-609代码:e0长度:20 mm
内存密度:9437184 bit内存集成电路类型:ZBT SRAM
内存宽度:18湿度敏感等级:3
功能数量:1端子数量:100
字数:524288 words字数代码:512000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-40 °C组织:512KX18
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:LQFP封装等效代码:QFP100,.63X.87
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2.5/3.3,3.3 V认证状态:Not Qualified
座面最大高度:1.6 mm最大待机电流:0.03 A
最小待机电流:3.14 V子类别:SRAMs
最大压摆率:0.56 mA最大供电电压 (Vsup):3.465 V
最小供电电压 (Vsup):3.135 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:TIN LEAD
端子形式:GULL WING端子节距:0.65 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:14 mmBase Number Matches:1

GVT71512ZC18-5 数据手册

 浏览型号GVT71512ZC18-5的Datasheet PDF文件第2页浏览型号GVT71512ZC18-5的Datasheet PDF文件第3页浏览型号GVT71512ZC18-5的Datasheet PDF文件第4页浏览型号GVT71512ZC18-5的Datasheet PDF文件第5页浏览型号GVT71512ZC18-5的Datasheet PDF文件第6页浏览型号GVT71512ZC18-5的Datasheet PDF文件第7页 
CY7C1354A/GVT71256ZC36  
CY7C1356A/GVT71512ZC18  
256K x 36/512K x 18 Pipelined SRAM  
with NoBL™ Architecture  
inputs include all addresses, all data inputs, depth-expansion  
Chip Enables (CE, CE2, and CE3), Cycle Start Input (ADV/LD),  
Clock Enable (CEN), Byte Write Enables (BWa, BWb, BWc,  
and BWd), and Read-Write Control (WEN). BWc and BWd  
apply to CY7C1354A/GVT71256ZC36 only.  
Features  
• Zero Bus Latency, no dead cycles between Write and  
Read cycles  
• Fast clock speed: 200, 166, 133, 100 MHz  
• Fast access time: 3.2, 3.6, 4.2, 5.0 ns  
• Internally synchronized registered outputs eliminate  
the need to control OE  
Address and control signals are applied to the SRAM during  
one clock cycle, and two cycles later, its associated data  
occurs, either Read or Write.  
• Single 3.3V –5% and +5% power supply VCC  
• Separate VCCQ for 3.3V or 2.5V I/O  
• Single WEN (Read/Write) control pin  
• Positive clock-edge triggered, address, data, and  
control signal registers for fully pipelined applications  
A
clock enable (CEN) pin allows operation of the  
CY7C1354A/GVT71256ZC36/CY7C1356A/GVT71512ZC18  
to be suspended as long as necessary. All synchronous inputs  
are ignored when (CEN) is HIGH and the internal device  
registers will hold their previous values.  
There are three chip enable pins (CE, CE2, CE3) that allow the  
user to deselect the device when desired. If any one of these  
three are not active when ADV/LD is LOW, no new memory  
operation can be initiated and any burst cycle in progress is  
stopped. However, any pending data transfers (Read or Write)  
will be completed. The data bus will be in high-impedance  
state two cycles after chip is deselected or a Write cycle is  
initiated.  
• Interleaved or linear four-word burst capability  
• Individual byte Write (BWa–BWd) control (may be tied  
LOW)  
• CEN pin to enable clock and suspend operations  
• Three chip enables for simple depth expansion  
•Automatic power-down feature available using ZZ mode  
or CE select  
• JTAG boundary scan  
• Low-profile 119-bump, 14-mm × 22-mm BGA (Ball Grid  
Array), and 100-pin TQFP packages  
The  
CY7C1354A/GVT71256ZC36  
and  
CY7C1356A/  
GVT71512ZC18 have an on-chip two-bit burst counter. In the  
burst mode, the CY7C1354A/GVT71256ZC36 and  
CY7C1356A/GVT71512ZC18 provide four cycles of data for a  
single address presented to the SRAM. The order of the burst  
sequence is defined by the MODE input pin. The MODE pin  
selects between linear and interleaved burst sequence. The  
ADV/LD signal is used to load a new external address  
(ADV/LD = LOW) or increment the internal burst counter  
(ADV/LD = HIGH)  
Functional Description  
The  
CY7C1354A/GVT71256ZC36  
and  
CY7C1356A/  
GVT71512ZC18 SRAMs are designed to eliminate dead  
cycles when transitioning from Read to Write or vice versa.  
These SRAMs are optimized for 100% bus utilization and  
achieve Zero Bus Latency  
(ZBL )/No Bus Latency  
(NoBL ). They integrate 262,144 × 36 and 524,288 × 18  
SRAM cells, respectively, with advanced synchronous  
peripheral circuitry and a two-bit counter for internal burst  
operation. These employ high-speed, low-power CMOS  
designs using advanced triple-layer polysilicon, double-layer  
metal technology. Each memory cell consists of four  
transistors and two high-valued resistors.  
Output Enable (OE), Sleep Enable (ZZ) and burst sequence  
select (MODE) are the asynchronous signals. OE can be used  
to disable the outputs at any given time. ZZ may be tied to  
LOW if it is not used.  
Four pins are used to implement JTAG test capabilities. The  
JTAG circuitry is used to serially shift data to and from the  
device. JTAG inputs use LVTTL/LVCMOS levels to shift data  
during this testing mode of operation.  
All synchronous inputs are gated by registers controlled by a  
positive-edge-triggered clock input (CLK). The synchronous  
Selection Guide  
7C1354A-200  
7C1354A-166  
71256ZC36-6 71256ZC36-7.5 71256ZC36-10  
7C1356A-166 7C1356A-133 7C1356A-100  
71512ZC18-6 71512ZC18-7.5 71512ZC18-10 Unit  
7C1354A-133  
7C1354A-100  
71256ZC36-5  
7C1356A-200  
71512ZC18-5  
Maximum Access Time  
3.2  
560  
30  
3.6  
480  
30  
4.2  
410  
30  
5.0  
350  
30  
ns  
Maximum Operating Current  
Commercial  
mA  
mA  
Maximum CMOS Standby Current Commercial  
Cypress Semiconductor Corporation  
3901 North First Street  
San Jose  
CA 95134  
408-943-2600  
Document #: 38-05161 Rev. *B  
Revised April 25, 2002  

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