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GS88118BGT-133 PDF预览

GS88118BGT-133

更新时间: 2024-11-27 05:46:39
品牌 Logo 应用领域
GSI 静态存储器内存集成电路
页数 文件大小 规格书
36页 840K
描述
Cache SRAM, 512KX18, 8.5ns, CMOS, PQFP100, TQFP-100

GS88118BGT-133 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:QFP包装说明:LQFP,
针数:100Reach Compliance Code:compliant
ECCN代码:3A991.B.2.BHTS代码:8542.32.00.41
风险等级:5.63最长访问时间:8.5 ns
其他特性:FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES WITH 3.3V SUPPLYJESD-30 代码:R-PQFP-G100
JESD-609代码:e3长度:20 mm
内存密度:9437184 bit内存集成电路类型:CACHE SRAM
内存宽度:18湿度敏感等级:3
功能数量:1端子数量:100
字数:524288 words字数代码:512000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:512KX18
封装主体材料:PLASTIC/EPOXY封装代码:LQFP
封装形状:RECTANGULAR封装形式:FLATPACK, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1.6 mm
最大供电电压 (Vsup):2.7 V最小供电电压 (Vsup):2.3 V
标称供电电压 (Vsup):2.5 V表面贴装:YES
技术:CMOS温度等级:COMMERCIAL
端子面层:PURE MATTE TIN端子形式:GULL WING
端子节距:0.65 mm端子位置:QUAD
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:14 mm
Base Number Matches:1

GS88118BGT-133 数据手册

 浏览型号GS88118BGT-133的Datasheet PDF文件第2页浏览型号GS88118BGT-133的Datasheet PDF文件第3页浏览型号GS88118BGT-133的Datasheet PDF文件第4页浏览型号GS88118BGT-133的Datasheet PDF文件第5页浏览型号GS88118BGT-133的Datasheet PDF文件第6页浏览型号GS88118BGT-133的Datasheet PDF文件第7页 
GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D)  
100-Pin TQFP & 165-bump BGA  
Commercial Temp  
Industrial Temp  
250 MHz133 MHz  
512K x 18, 256K x 32, 256K x 36  
9Mb Sync Burst SRAMs  
2.5 V or 3.3 V V  
DD  
2.5 V or 3.3 V I/O  
internally and are controlled by ADV. The burst address  
Features  
counter may be configured to count in either linear or  
interleave order with the Linear Burst Order (LBO) input. The  
Burst function need not be used. New addresses can be loaded  
on every cycle with no degradation of chip performance.  
• IEEE 1149.1 JTAG-compatible Boundary Scan  
• 2.5 V or 3.3 V +10%/–10% core power supply  
• 2.5 V or 3.3 V I/O supply  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Byte Write (BW) and/or Global Write (GW) operation  
• Internal self-timed write cycle  
Flow Through/Pipeline Reads  
The function of the Data Output register can be controlled by  
the user via the FT mode pin (Pin 14). Holding the FT mode pin  
low places the RAM in Flow Through mode, causing output  
data to bypass the Data Output Register. Holding FT high  
places the RAM in Pipeline mode, activating the rising-edge-  
triggered Data Output Register.  
• Automatic power-down for portable applications  
• JEDEC-standard packages  
-250 -225 -200 -166 -150 -133 Unit  
SCD Pipelined Reads  
Pipeline  
3-1-1-1  
t
2.5 2.7 3.0 3.4 3.8 4.0 ns  
4.0 4.4 5.0 6.0 6.7 7.5 ns  
KQ  
The GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D) is a  
SCD (Single Cycle Deselect) pipelined synchronous SRAM.  
DCD (Dual Cycle Deselect) versions are also available. SCD  
SRAMs pipeline deselect commands one stage less than read  
commands. SCD RAMs begin turning off their outputs  
immediately after the deselect command has been captured in  
the input registers.  
tCycle  
Curr (x18)  
280 255 230 200 185 165 mA  
3.3 V  
2.5 V  
Curr (x32/x36) 330 300 270 230 215 190 mA  
Curr (x18) 275 250 230 195 180 165 mA  
Curr (x32/x36) 320 295 265 225 210 185 mA  
t
Flow  
Through  
2-1-1-1  
5.5 6.0 6.5 7.0 7.5 8.5 ns  
5.5 6.0 6.5 7.0 7.5 8.5 ns  
KQ  
tCycle  
Byte Write and Global Write  
Byte write operation is performed by using Byte Write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write  
control inputs.  
Curr (x18)  
175 165 160 150 145 135 mA  
3.3 V  
2.5 V  
Curr (x32/x36) 200 190 180 170 165 150 mA  
Curr (x18) 175 165 160 150 145 135 mA  
Curr (x32/x36) 200 190 180 170 165 150 mA  
Sleep Mode  
Functional Description  
Low power (Sleep mode) is attained through the assertion  
(High) of the ZZ signal, or by stopping the clock (CK).  
Memory data is retained during Sleep mode.  
Applications  
The GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D) is a  
9,437,184-bit high performance synchronous SRAM with a 2-  
bit burst address counter. Although of a type originally  
developed for Level 2 Cache applications supporting high  
performance CPUs, the device now finds application in  
synchronous SRAM applications, ranging from DSP main  
store to networking chip set support.  
Core and Interface Voltages  
The GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D)  
operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V  
and 2.5 V compatible. Separate output power (V  
) pins are  
DDQ  
used to decouple output noise from the internal circuits and are  
3.3 V and 2.5 V compatible.  
Controls  
Addresses, data I/Os, chip enable (E1, E2), address burst  
control inputs (ADSP, ADSC, ADV) and write control inputs  
(Bx, BW, GW) are synchronous and are controlled by a  
positive-edge-triggered clock input (CK). Output enable (G)  
and power down control (ZZ) are asynchronous inputs. Burst  
cycles can be initiated with either ADSP or ADSC inputs. In  
Burst mode, subsequent burst addresses are generated  
Rev: 1.01 8/2003  
1/36  
© 2002, Giga Semiconductor, Inc.  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  
ByteSafe is a Trademark of Giga Semiconductor, Inc. (GSI Technology).  

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