GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D)
100-Pin TQFP & 165-bump BGA
Commercial Temp
Industrial Temp
250 MHz–133 MHz
512K x 18, 256K x 32, 256K x 36
9Mb Sync Burst SRAMs
2.5 V or 3.3 V V
DD
2.5 V or 3.3 V I/O
internally and are controlled by ADV. The burst address
Features
counter may be configured to count in either linear or
interleave order with the Linear Burst Order (LBO) input. The
Burst function need not be used. New addresses can be loaded
on every cycle with no degradation of chip performance.
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 2.5 V or 3.3 V +10%/–10% core power supply
• 2.5 V or 3.3 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
Flow Through/Pipeline Reads
The function of the Data Output register can be controlled by
the user via the FT mode pin (Pin 14). Holding the FT mode pin
low places the RAM in Flow Through mode, causing output
data to bypass the Data Output Register. Holding FT high
places the RAM in Pipeline mode, activating the rising-edge-
triggered Data Output Register.
• Automatic power-down for portable applications
• JEDEC-standard packages
-250 -225 -200 -166 -150 -133 Unit
SCD Pipelined Reads
Pipeline
3-1-1-1
t
2.5 2.7 3.0 3.4 3.8 4.0 ns
4.0 4.4 5.0 6.0 6.7 7.5 ns
KQ
The GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D) is a
SCD (Single Cycle Deselect) pipelined synchronous SRAM.
DCD (Dual Cycle Deselect) versions are also available. SCD
SRAMs pipeline deselect commands one stage less than read
commands. SCD RAMs begin turning off their outputs
immediately after the deselect command has been captured in
the input registers.
tCycle
Curr (x18)
280 255 230 200 185 165 mA
3.3 V
2.5 V
Curr (x32/x36) 330 300 270 230 215 190 mA
Curr (x18) 275 250 230 195 180 165 mA
Curr (x32/x36) 320 295 265 225 210 185 mA
t
Flow
Through
2-1-1-1
5.5 6.0 6.5 7.0 7.5 8.5 ns
5.5 6.0 6.5 7.0 7.5 8.5 ns
KQ
tCycle
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write
control inputs.
Curr (x18)
175 165 160 150 145 135 mA
3.3 V
2.5 V
Curr (x32/x36) 200 190 180 170 165 150 mA
Curr (x18) 175 165 160 150 145 135 mA
Curr (x32/x36) 200 190 180 170 165 150 mA
Sleep Mode
Functional Description
Low power (Sleep mode) is attained through the assertion
(High) of the ZZ signal, or by stopping the clock (CK).
Memory data is retained during Sleep mode.
Applications
The GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D) is a
9,437,184-bit high performance synchronous SRAM with a 2-
bit burst address counter. Although of a type originally
developed for Level 2 Cache applications supporting high
performance CPUs, the device now finds application in
synchronous SRAM applications, ranging from DSP main
store to networking chip set support.
Core and Interface Voltages
The GS88118B(T/D)/GS88132B(T/D)/GS88136B(T/D)
operates on a 2.5 V or 3.3 V power supply. All input are 3.3 V
and 2.5 V compatible. Separate output power (V
) pins are
DDQ
used to decouple output noise from the internal circuits and are
3.3 V and 2.5 V compatible.
Controls
Addresses, data I/Os, chip enable (E1, E2), address burst
control inputs (ADSP, ADSC, ADV) and write control inputs
(Bx, BW, GW) are synchronous and are controlled by a
positive-edge-triggered clock input (CK). Output enable (G)
and power down control (ZZ) are asynchronous inputs. Burst
cycles can be initiated with either ADSP or ADSC inputs. In
Burst mode, subsequent burst addresses are generated
Rev: 1.01 8/2003
1/36
© 2002, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
ByteSafe is a Trademark of Giga Semiconductor, Inc. (GSI Technology).