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GS84032CGT-200 PDF预览

GS84032CGT-200

更新时间: 2024-11-30 13:48:07
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22页 408K
描述
100 TQFP

GS84032CGT-200 数据手册

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GS84018/32/36CGT-250/200/166/150  
TQFP  
Commercial Temp  
Industrial Temp  
250 MHz–150 MHz  
256K x 18, 128K x 32, 128K x 36  
4Mb Sync Burst SRAMs  
3.3 V V  
DD  
3.3 V and 2.5 V I/O  
counter may be configured to count in either linear or  
Features  
interleave order with the Linear Burst Order (LBO) input. The  
burst function need not be used. New addresses can be loaded  
on every cycle with no degradation of chip performance.  
• FT pin for user-configurable flow through or pipelined  
operation  
• Single Cycle Deselect (SCD) operation  
• 3.3 V +10%/–5% core power supply  
Flow Through/Pipeline Reads  
• 2.5 V or 3.3 V I/O supply  
The function of the Data Output register can be controlled by  
the user via the FT mode pin/bump (pin 14 in the TQFP and  
bump 5R in the BGA). Holding the FT mode pin/bump low  
places the RAM in Flow Through mode, causing output data to  
bypass the Data Output Register. Holding FT high places the  
RAM in Pipelined mode, activating the rising-edge-triggered  
Data Output Register.  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Default to Interleaved Pipelined mode  
• Byte Write (BW) and/or Global Write (GW) operation  
• Common data inputs and data outputs  
• Clock control, registered, address, data, and control  
• Internal self-timed write cycle  
SCD Pipelined Reads  
• Automatic power-down for portable applications  
• RoHS-compliant 100-lead TQFP package  
The GS84018/32/36CGT is an SCD (Single Cycle Deselect)  
pipelined synchronous SRAM. DCD (Dual Cycle Deselect)  
versions are also available. SCD SRAMs pipeline deselect  
commands one stage less than read commands. SCD RAMs  
begin turning off their outputs immediately after the deselect  
command has been captured in the input registers.  
Functional Description  
Applications  
The GS84018/32/36CGT is a 4,718,592-bit (4,194,304-bit for  
x32 version) high performance synchronous SRAM with a 2-  
bit burst address counter. Although of a type originally  
developed for Level 2 Cache applications supporting high  
performance CPUs, the device now finds application in  
synchronous SRAM applications ranging from DSP main store  
to networking chip set support. The GS84018/32/36CGT is  
available in a JEDEC standard 100-lead TQFP package.  
Byte Write and Global Write  
Byte write operation is performed by using byte write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write  
control inputs.  
Sleep Mode  
Controls  
Low power (Sleep mode) is attained through the assertion  
(High) of the ZZ signal, or by stopping the clock (CK).  
Memory data is retained during Sleep mode.  
Addresses, data I/Os, chip enables (E1, E2, E3), address burst  
control inputs (ADSP, ADSC, ADV), and write control inputs  
(Bx, BW, GW) are synchronous and are controlled by a  
positive-edge-triggered clock input (CK). Output enable (G)  
and power down control (ZZ) are asynchronous inputs. Burst  
cycles can be initiated with either ADSP or ADSC inputs. In  
Burst mode, subsequent burst addresses are generated  
internally and are controlled by ADV. The burst address  
Core and Interface Voltages  
The GS84018/32/36CGT operates on a 3.3 V power supply  
and all inputs/outputs are 3.3 V- and 2.5 V-compatible.  
Separate output power (V  
) pins are used to de-couple  
DDQ  
output noise from the internal circuit.  
Parameter Synopsis  
-250  
-200  
-166  
-150  
Unit  
tKQ  
2.5  
4.0  
3.0  
5.0  
3.0  
5.0  
3.8  
6.7  
ns  
ns  
tCycle  
Pipeline  
3-1-1-1  
Curr (x18)  
Curr (x32/x36)  
195  
225  
170  
195  
160  
185  
140  
160  
mA  
mA  
tKQ  
5.5  
5.5  
6.5  
6.5  
6.5  
6.5  
7.5  
7.5  
ns  
ns  
tCycle  
Flow Through  
2-1-1-1  
Curr (x18)  
Curr (x32/x36)  
160  
180  
140  
160  
135  
155  
128  
145  
mA  
mA  
Rev: 1.01 11/2014  
1/22  
© 2014, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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