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GS8342T09BGD-333I PDF预览

GS8342T09BGD-333I

更新时间: 2023-12-06 20:13:28
品牌 Logo 应用领域
GSI 时钟双倍数据速率静态存储器内存集成电路
页数 文件大小 规格书
35页 576K
描述
165 BGA

GS8342T09BGD-333I 数据手册

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GS8342T08/09/18/36BD-400/350/333/300/250  
Special Functions  
Byte Write and Nybble Write Control  
Byte Write Enable pins are sampled at the same time that Data In is sampled. A high on the Byte Write Enable pin associated with  
a particular byte (e.g., BW0 controls D0–D8 inputs) will inhibit the storage of that particular byte, leaving whatever data may be  
stored at the current address at that byte location undisturbed. Any or all of the Byte Write Enable pins may be driven high or low  
during the data in sample times in a write sequence.  
Each write enable command and write address loaded into the RAM provides the base address for a 2 beat data transfer. The x18  
version of the RAM, for example, may write 36 bits in association with each address loaded. Any 9-bit byte may be masked in any  
write sequence.  
Nybble Write (4-bit) write control is implemented on the 8-bit-wide version of the device. For the x8 version of the device,  
“Nybble Write Enable” and “NBx” may be substituted in all the discussion above.  
Example x18 RAM Write Sequence using Byte Write Enables  
Data In Sample Time  
BW0  
BW1  
D0–D8  
Data In  
D9–D17  
Don’t Care  
Data In  
Beat 1  
Beat 2  
0
1
1
0
Don’t Care  
Resulting Write Operation  
Byte 1  
D0–D8  
Byte 2  
D9–D17  
Byte 3  
D0–D8  
Byte 4  
D9–D17  
Written  
Unchanged  
Unchanged  
Written  
Beat 1  
Beat 2  
Output Register Control  
SigmaDDR-II SRAMs offer two mechanisms for controlling the output data registers. Typically, control is handled by the Output  
Register Clock inputs, C and C. The Output Register Clock inputs can be used to make small phase adjustments in the firing of the  
output registers by allowing the user to delay driving data out as much as a few nanoseconds beyond the next rising edges of the K  
and K clocks. If the C and C clock inputs isare tied high, the RAM reverts to K and K control of the outputs, allowing the RAM to  
function as a conventional pipelined read SRAM.  
FLXDrive-II Output Driver Impedance Control  
HSTL I/O SigmaDDR-II SRAMs are supplied with programmable impedance output drivers. The ZQ pin must be connected to  
V
via an external resistor, RQ, to allow the SRAM to monitor and adjust its output driver impedance. The value of RQ must be  
SS  
5X the value of the desired RAM output impedance at mid-rail. The allowable range of RQ to guarantee impedance matching  
continuously is between 175and 350. Periodic readjustment of the output driver impedance is necessary as the impedance is  
affected by drifts in supply voltage and temperature. The SRAM’s output impedance circuitry compensates for drifts in supply  
voltage and temperature. A clock cycle counter periodically triggers an impedance evaluation, resets and counts again. Each  
impedance evaluation may move the output driver impedance level one step at a time towards the optimum level. The output driver  
is implemented with discrete binary weighted impedance steps.  
Rev: 1.02b 8/2017  
8/35  
© 2011, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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