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GS8320E18AGT-200IV PDF预览

GS8320E18AGT-200IV

更新时间: 2024-11-24 13:48:03
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22页 331K
描述
100 TQFP

GS8320E18AGT-200IV 数据手册

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GS8320E18/32/36AGT-xxxV  
333 MHz150 MHz  
100-Pin TQFP  
Commercial Temp  
Industrial Temp  
2M x 18, 1M x 32, 1M x 36  
36Mb Sync Burst SRAMs  
1.8 V or 2.5 V V  
DD  
1.8 V or 2.5 V I/O  
internally and are controlled by ADV. The burst address  
counter may be configured to count in either linear or  
interleave order with the Linear Burst Order (LBO) input. The  
Burst function need not be used. New addresses can be loaded  
on every cycle with no degradation of chip performance.  
Features  
• FT pin for user-configurable flow through or pipeline  
operation  
• Single Dual Cycle Deselect (SDCD) operation  
• 1.8 V or 2.5 V core power supply  
• 1.8 V or 2.5 V I/O supply  
DCD Pipelined Reads  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Byte Write (BW) and/or Global Write (GW) operation  
• Internal self-timed write cycle  
• Automatic power-down for portable applications  
• RoHS-compliant 100-lead TQFP package available  
The GS8320E18/32/36AGT-xxxV is a DCD (Dual Cycle  
Deselect) pipelined synchronous SRAM. SCD (Single Cycle  
Deselect) versions are also available. DCD SRAMs pipeline  
disable commands to the same degree as read commands. DCD  
RAMs hold the deselect command for one full cycle and then  
begin turning off their outputs just after the second rising edge  
of clock.  
Functional Description  
Byte Write and Global Write  
Byte write operation is performed by using Byte Write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write  
control inputs.  
Applications  
The GS8320E18/32/36AGT-xxxV is a 37,748,736-bit high  
performance synchronous SRAM with a 2-bit burst address  
counter. Although of a type originally developed for Level 2  
Cache applications supporting high performance CPUs, the  
device now finds application in synchronous SRAM  
applications, ranging from DSP main store to networking chip  
set support.  
Sleep Mode  
Low power (Sleep mode) is attained through the assertion  
(High) of the ZZ signal, or by stopping the clock (CK).  
Memory data is retained during Sleep mode.  
Controls  
Addresses, data I/Os, chip enables (E1, E2, E3), address burst  
control inputs (ADSP, ADSC, ADV), and write control inputs  
(Bx, BW, GW) are synchronous and are controlled by a  
positive-edge-triggered clock input (CK). Output enable (G)  
and power down control (ZZ) are asynchronous inputs. Burst  
cycles can be initiated with either ADSP or ADSC inputs. In  
Burst mode, subsequent burst addresses are generated  
Core and Interface Voltages  
The GS8320E18/32/36AGT-xxxV operates on a 1.8 V or 2.5 V  
power supply. All inputs are 1.8 V or 2.5 V compatible.  
Separate output power (V  
) pins are used to decouple  
DDQ  
output noise from the internal circuits and are 1.8 V or 2.5 V  
compatible.  
Parameter Synopsis  
-333  
-250  
-200  
-150  
Unit  
t
3.0  
3.0  
3.0  
4.0  
3.0  
5.0  
3.8  
6.7  
ns  
ns  
KQ  
Pipeline  
3-1-1-1  
tCycle  
Curr (x18)  
Curr (x32/x36)  
365  
425  
290  
345  
250  
290  
215  
240  
mA  
mA  
t
5.0  
5.0  
5.5  
5.5  
6.5  
6.5  
7.5  
7.5  
ns  
ns  
KQ  
Flow  
Through  
2-1-1-1  
tCycle  
Curr (x18)  
Curr (x32/x36)  
270  
315  
245  
280  
210  
250  
200  
230  
mA  
mA  
Rev: 1.03 8/2013  
1/22  
© 2011, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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