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GS816273GC-250I PDF预览

GS816273GC-250I

更新时间: 2024-11-19 06:35:23
品牌 Logo 应用领域
GSI 静态存储器
页数 文件大小 规格书
25页 1018K
描述
Cache SRAM, 256KX72, 2.6ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, BGA-209

GS816273GC-250I 数据手册

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GS816273C-250/225  
209-Pin BGA  
Commercial Temp  
Industrial Temp  
250 MHz225 MHz  
256K x 72  
18Mb S/DCD Sync Burst SRAMs  
2.5 V or 3.3 V V  
DD  
2.5 V or 3.3 V I/O  
SCD and DCD Pipelined Reads  
Features  
The GS816273C is a SCD (Single Cycle Deselect) and DCD  
(Dual Cycle Deselect) pipelined synchronous SRAM. DCD  
SRAMs pipeline disable commands to the same degree as read  
commands. SCD SRAMs pipeline deselect commands one  
stage less than read commands. SCD RAMs begin turning off  
their outputs immediately after the deselect command has been  
captured in the input registers. DCD RAMs hold the deselect  
command for one full cycle and then begin turning off their  
outputs just after the second rising edge of clock. The user may  
configure this SRAM for either mode of operation using the  
SCD mode input.  
• Single/Dual Cycle Deselect selectable  
• IEEE 1149.1 JTAG-compatible Boundary Scan  
• ZQ mode pin for user-selectable high/low output drive  
• 2.5 or 3.3 V +10%/–10% core power supply  
• 2.5 V or 3.3 V I/O supply  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Byte Write (BW) and/or Global Write (GW) operation  
• Internal self-timed write cycle  
• Automatic power-down for portable applications  
• JEDEC-standard 209-bump BGA package  
Byte Write and Global Write  
Functional Description  
Byte write operation is performed by using Byte Write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write  
control inputs.  
Applications  
The GS816273C is an 18,874,368-bit high performance  
synchronous SRAM with a 2-bit burst address counter.  
Although of a type originally developed for Level 2 Cache  
applications supporting high performance CPUs, the device  
now finds application in synchronous SRAM applications,  
ranging from DSP main store to networking chip set support.  
FLXDrive™  
The ZQ pin allows selection between high drive strength (ZQ  
low) for multi-drop bus applications and normal drive strength  
(ZQ floating or high) point-to-point applications. See the  
Output Driver Characteristics chart for details.  
Controls  
Addresses, data I/Os, chip enable (E1), address burst control  
inputs (ADSP, ADSC, ADV), and write control inputs (Bx,  
BW, GW) are synchronous and are controlled by a positive-  
edge-triggered clock input (CK). Output enable (G) and power  
down control (ZZ) are asynchronous inputs. Burst cycles can  
be initiated with either ADSP or ADSC inputs. In Burst mode,  
subsequent burst addresses are generated internally and are  
controlled by ADV. The burst address counter may be  
configured to count in either linear or interleave order with the  
Linear Burst Order (LBO) input. The Burst function need not  
be used. New addresses can be loaded on every cycle with no  
degradation of chip performance.  
Sleep Mode  
Low power (Sleep mode) is attained through the assertion  
(High) of the ZZ signal, or by stopping the clock (CK).  
Memory data is retained during Sleep mode.  
Core and Interface Voltages  
The GS816273C operates on a 2.5 V or 3.3 V power supply.  
All input are 3.3 V and 2.5 V compatible. Separate output  
power (V  
) pins are used to decouple output noise from the  
DDQ  
internal circuits and are 3.3 V and 2.5 V compatible.  
Parameter Synopsis  
-250  
-225  
Unit  
Pipeline  
3-1-1-1  
t
2.6  
4.0  
2.6  
4.5  
ns  
ns  
KQ  
tCycle  
3.3 V  
2.5 V  
Curr (x72)  
Curr (x72)  
430  
410  
400  
375  
mA  
mA  
Rev: 1.03 7/2004  
1/25  
© 2002, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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