Preliminary
GS8161V18B(T/D)/GS8161V32B(D)/GS8161V36B(T/D)
250 MHz–150 MHz
100-Pin TQFP & 165-Bump BGA
Commercial Temp
Industrial Temp
1M x 18, 512K x 32, 512K x 36
18Mb Sync Burst SRAMs
1.8 V V
DD
1.8 V I/O
either linear or interleave order with the Linear Burst Order (LBO)
input. The Burst function need not be used. New addresses can be
loaded on every cycle with no degradation of chip performance.
Features
• FT pin for user-configurable flow through or pipeline
operation
Flow Through/Pipeline Reads
• Single Cycle Deselect (SCD) operation
• IEEE 1149.1 JTAG-compatible Boundary Scan
• 1.8 V +10%/–10% core power supply
The function of the Data Output register can be controlled by the
user via the FT mode pin (Pin 14). Holding the FT mode pin low
places the RAM in Flow Through mode, causing output data to
bypass the Data Output Register. Holding FT high places the
RAM in Pipeline mode, activating the rising-edge-triggered Data
Output Register.
• 1.8 V I/O supply
• LBO pin for Linear or Interleaved Burst mode
• Internal input resistors on mode pins allow floating mode pins
• Default to Interleaved Pipeline mode
• Byte Write (BW) and/or Global Write (GW) operation
• Internal self-timed write cycle
SCD Pipelined Reads
The GS8161V18B(T/D)/GS8161V32B(D)/GS8161V36B(T/D) is
a SCD (Single Cycle Deselect) pipelined synchronous SRAM.
DCD (Dual Cycle Deselect) versions are also available. SCD
SRAMs pipeline deselect commands one stage less than read
commands. SCD RAMs begin turning off their outputs
immediately after the deselect command has been captured in the
input registers.
• Automatic power-down for portable applications
• JEDEC-standard 100-lead TQFP and 165-bump BGA packages
• Pb-Free 100-lead TQFP package available
Functional Description
Applications
The GS8161V18B(T/D)/GS8161V32B(D)/GS8161V36B(T/D) is
an 18,874,368-bit high performance synchronous SRAM with a 2-
bit burst address counter. Although of a type originally developed
for Level 2 Cache applications supporting high performance
CPUs, the device now finds application in synchronous SRAM
applications, ranging from DSP main store to networking chip set
support.
Byte Write and Global Write
Byte write operation is performed by using Byte Write enable
(BW) input combined with one or more individual byte write
signals (Bx). In addition, Global Write (GW) is available for
writing all bytes at one time, regardless of the Byte Write control
inputs.
Sleep Mode
Controls
Low power (Sleep mode) is attained through the assertion (High)
of the ZZ signal, or by stopping the clock (CK). Memory data is
retained during Sleep mode.
Addresses, data I/Os, chip enable (E1), address burst control
inputs (ADSP, ADSC, ADV) and write control inputs (Bx, BW,
GW) are synchronous and are controlled by a positive-edge-
triggered clock input (CK). Output enable (G) and power down
control (ZZ) are asynchronous inputs. Burst cycles can be initiated
with either ADSP or ADSC inputs. In Burst mode, subsequent
burst addresses are generated internally and are controlled by
ADV. The burst address counter may be configured to count in
Core and Interface Voltages
The GS8161V18B(T/D)/GS8161V32B(D)/GS8161V36B(T/D)
operates on a 1.8 V power supply. All input are 1..8 V compatible.
Separate output power (VDDQ) pins are used to decouple output
noise from the internal circuits and are 1.8 V compatible.
Parameter Synopsis
-250
-200
-150
Unit
tKQ
2.5
4.0
3.0
5.0
3.8
6.7
ns
ns
tCycle
Pipeline
3-1-1-1
280
330
230
270
185
210
mA
mA
Curr (x18)
Curr (x32/x36)
tKQ
tCycle
5.5
5.5
6.5
6.5
7.5
7.5
ns
ns
Flow Through
2-1-1-1
210
240
185
205
170
190
mA
mA
Curr (x18)
Curr (x32/x36)
Rev: 1.00 8/2004
1/34
© 2004, GSI Technology
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.