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GS256418GB-250I PDF预览

GS256418GB-250I

更新时间: 2024-01-15 16:57:25
品牌 Logo 应用领域
GSI 静态存储器内存集成电路
页数 文件大小 规格书
35页 431K
描述
16M x 18, 8M x 36 288Mb DCD Sync Burst SRAMs

GS256418GB-250I 技术参数

生命周期:Active包装说明:BGA,
Reach Compliance Code:compliantECCN代码:3A991.B.2.B
HTS代码:8542.32.00.41风险等级:5.79
JESD-30 代码:R-PBGA-B119长度:22 mm
内存密度:301989888 bit内存集成电路类型:CACHE SRAM
内存宽度:18功能数量:1
端子数量:119字数:16777216 words
字数代码:16000000工作模式:SYNCHRONOUS
组织:16MX18封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装形状:RECTANGULAR
封装形式:GRID ARRAY并行/串行:PARALLEL
座面最大高度:1.99 mm最大供电电压 (Vsup):2.7 V
最小供电电压 (Vsup):2.3 V标称供电电压 (Vsup):2.5 V
表面贴装:YES技术:CMOS
端子形式:BALL端子节距:1.27 mm
端子位置:BOTTOM宽度:14 mm
Base Number Matches:1

GS256418GB-250I 数据手册

 浏览型号GS256418GB-250I的Datasheet PDF文件第2页浏览型号GS256418GB-250I的Datasheet PDF文件第3页浏览型号GS256418GB-250I的Datasheet PDF文件第4页浏览型号GS256418GB-250I的Datasheet PDF文件第5页浏览型号GS256418GB-250I的Datasheet PDF文件第6页浏览型号GS256418GB-250I的Datasheet PDF文件第7页 
GS8256418/36(GB/GD)-400/333/250/200  
119- & 165-Bump BGA  
Commercial Temp  
Industrial Temp  
400 MHz200 MHz  
16M x 18, 8M x 36  
288Mb DCD Sync Burst SRAMs  
2.5 V or 3.3 V V  
DD  
2.5 V or 3.3 V I/O  
either linear or interleave order with the Linear Burst Order (LBO)  
input. The Burst function need not be used. New addresses can be  
loaded on every cycle with no degradation of chip performance.  
Features  
• FT pin for user-configurable flow through or pipeline operation  
• Single/Dual Cycle Deselect selectable  
• IEEE 1149.1 JTAG-compatible Boundary Scan  
• ZQ mode pin for user-selectable high/low output drive  
• 2.5 V +10%/–10% core power supply  
• 3.3 V +10%/–10% core power supply  
• 2.5 V or 3.3 V I/O supply  
• LBO pin for Linear or Interleaved Burst mode  
• Internal input resistors on mode pins allow floating mode pins  
• Byte Write (BW) and/or Global Write (GW) operation  
• Internal self-timed write cycle  
• ZZ pin for automatic power-down  
• RoHS-compliant 119-bump and 165-bump BGA packages  
Flow Through/Pipeline Reads  
The function of the Data Output register can be controlled by the  
user via the FT mode . Holding the FT mode pin low places the  
RAM in Flow Through mode, causing output data to bypass the  
Data Output Register. Holding FT high places the RAM in  
Pipeline mode, activating the rising-edge-triggered Data Output  
Register.  
DCD Pipelined Reads  
The GS8256418/36 is a DCD (Dual Cycle Deselect) pipelined  
synchronous SRAM. DCD SRAMs pipeline disable commands to  
the same degree as read commands. DCD RAMs hold the deselect  
command for one full cycle and then begin turning off their  
outputs just after the second rising edge of clock.  
Functional Description  
Applications  
The GS8256418/36 is a 301,989,888-bit high performance  
Byte Write and Global Write  
Byte write operation is performed by using Byte Write enable  
(BW) input combined with one or more individual byte write  
signals (Bx). In addition, Global Write (GW) is available for  
writing all bytes at one time, regardless of the Byte Write control  
inputs.  
synchronous SRAM with a 2-bit burst address counter. Although  
of a type originally developed for Level 2 Cache applications  
supporting high performance CPUs, the device now finds  
application in synchronous SRAM applications, ranging from  
DSP main store to networking chip set support.  
Controls  
FLXDrive™  
Addresses, data I/Os, chip enable (E1), address burst control  
The ZQ pin allows selection between high drive strength (ZQ low)  
inputs (ADSP, ADSC, ADV), and write control inputs (Bx, BW,  
GW) are synchronous and are controlled by a positive-edge-  
triggered clock input (CK). Output enable (G) and power down  
control (ZZ) are asynchronous inputs. Burst cycles can be initiated  
with either ADSP or ADSC inputs. In Burst mode, subsequent  
burst addresses are generated internally and are controlled by  
ADV. The burst address counter may be configured to count in  
for multi-drop bus applications and normal drive strength (ZQ  
floating or high) point-to-point applications. See the Output Driver  
Characteristics chart for details.  
Core and Interface Voltages  
The GS8256418/36 operates on a 2.5 V or 3.3 V power supply.  
All input are 3.3 V and 2.5 V compatible. Separate output power  
Parameter Synopsis  
-400  
-333  
-250  
-200  
Unit  
tKQ  
2.5  
2.5  
2.5  
3.0  
2.5  
4.0  
3.0  
5.0  
ns  
ns  
tCycle  
Pipeline  
3-1-1-1  
Curr (x18)  
Curr (x36)  
730  
820  
650  
720  
540  
590  
520  
470  
mA  
mA  
tKQ  
tCycle  
4.0  
4.0  
4.5  
4.5  
5.5  
5.5  
6.5  
6.5  
ns  
ns  
Flow Through  
2-1-1-1  
Curr (x18)  
Curr (x36)  
520  
540  
500  
550  
440  
500  
410  
470  
mA  
mA  
Rev: 1.03 5/2017  
1/34  
© 2015, GSI Technology  
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.  

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